Template:Short description

File:168 pin and 184 pin DIMM.jpg
Two types of DIMMs: a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). The SDRAM module has two notches (rectangular cuts or incisions) on the bottom edge, while the DDR1 SDRAM module has one. Also, each module has eight RAM chips, but the lower one has an unoccupied space for the ninth chip; this space is occupied in ECC DIMMs.
File:Abit-BP6 (cropped) SDRAM DIMM slots.JPG
Three SDRAM DIMM slots on a ABIT BP6 computer motherboard.

A DIMM (Dual In-line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins.<ref name="GeeksforGeeks 2020 e240">{{#invoke:citation/CS1|citation |CitationClass=web }}</ref> The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and capacities, and are generally one of two lengths: PC, which are Template:Convert, and laptop (SO-DIMM), which are about half the length at Template:Convert.<ref name=":0" />

HistoryEdit

DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules)<ref>Template:Cite book</ref><ref>Template:Cite book</ref> as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel.

DIMMs were introduced to eliminate this disadvantage. The contacts on SIMMs on both sides are redundant, while DIMMs have separate electrical contacts on each side of the module.<ref>Template:Cite book</ref> This allowed them to double the SIMMs 32-bit data path into a 64-bit data path.<ref name="auto1">Template:Cite book</ref>

The name "DIMM" was chosen as an acronym for Dual In-line Memory Module symbolizing the split in the contacts of a SIMM into two independent rows.<ref name="auto1"/> Many enhancements have occurred to the modules in the intervening years, but the word "DIMM" has remained as one of the generic termsTemplate:Clarify for a computer memory module.

VariantsEdit

There are numerous DIMM variants, employing different pin-counts:

DIMM

|CitationClass=web }}</ref>

SO-DIMM
  • Template:072-pin: FPM DRAM and EDO DRAM;<ref name="auto">Template:Cite book</ref> different pin configuration from 72-pin SIMM
  • 144-pin: SDR SDRAM,<ref name="auto"/> sometimes used for DDR2 SDRAM
  • 200-pin: DDR SDRAM<ref name="auto"/> and DDR2 SDRAM
  • 204-pin: DDR3 SDRAM
  • 260-pin: DDR4 SDRAM
  • 260-pin: UniDIMMs carrying either DDR3 or DDR4 SDRAM; differently notched than DDR4 SO-DIMMs
  • 262-pin: DDR5 SDRAM
MiniDIMM
  • 244-pin: DDR2 SDRAM
File:Nanonote 03 2.jpg
256 MB MicroDIMM PC133 SDRAM (double sided, 4 chips).
MicroDIMM
  • 144-pin: SDRAM<ref name="auto"/>
  • 172-pin: DDR SDRAM<ref name="auto"/>
  • 214-pin: DDR2 SDRAM

SO-DIMMEdit

File:Assorted SO-DIMM Modules.jpg
Assorted SO-DIMM Modules
File:4GB DDR3 SO-DIMM.jpg
A 204-pin PC3-10600 DDR3 SO-DIMM.
File:DDR SO-DIMM slot PNr°0341.jpg
A SO-DIMM slot on a computer motherboard.

A SO-DIMM (pronounced "so dim" Template:IPAc-en, also spelled SODIMM) or small outline DIMM, is a smaller alternative to a DIMM, being roughly half the physical size of a regular DIMM. The first SO-DIMMs had 72 pins and were introduced by JEDEC in 1997.<ref name="auto"/><ref>{{#invoke:citation/CS1|citation |CitationClass=web }}</ref><ref>{{#invoke:citation/CS1|citation |CitationClass=web }}</ref> Before its introduction, many laptops would use proprietary<ref>{{#invoke:citation/CS1|citation |CitationClass=web }}</ref> RAM modules which were expensive and hard to find.<ref name="auto"/><ref>Template:Cite book</ref>

SO-DIMMs are often used in computers that have limited space, which include laptops, notebook computers, small-footprint personal computers such as those based on Nano-ITX motherboards, high-end upgradable office printers, and networking hardware such as routers and NAS devices.<ref>{{#invoke:citation/CS1|citation |CitationClass=web }}</ref> They are usually available with the same size data path and speed ratings of the regular DIMMs though normally with smaller capacities.

SDR 168-pin SDRAMEdit

File:Notch position between DDR and DDR2.jpg
Notch positions on DDR (top) and DDR2 (bottom) DIMM modules.

On the bottom edge of 168-pin DIMMs there are two notches, and the location of each notch determines a particular feature of the module. The first notch is the DRAM key position, which represents RFU (reserved future use), registered, and unbuffered DIMM types (left, middle and right position, respectively). The second notch is the voltage key position, which represents 5.0 V, 3.3 V, and RFU DIMM types (order is the same as above).

DDR DIMMsEdit

DDR, DDR2, DDR3, DDR4 and DDR5 all have different pin counts and/or different notch positions, and none of them are forward compatible or backward compatible. DDR5 SDRAM is the most recent type of DDR memory and has been in use since 2020.

SPD EEPROMEdit

A DIMM's capacity and other operational parameters may be identified with serial presence detect (SPD), an additional chip which contains information about the module type and timing for the memory controller to be configured correctly. The SPD EEPROM connects to the System Management Bus and may also contain thermal sensors (TS-on-DIMM).<ref>{{#invoke:citation/CS1|citation |CitationClass=web }}</ref>

Error correctionEdit

ECC DIMMs are those that have extra data bits which can be used by the system memory controller to detect and correct errors. There are numerous ECC schemes, but perhaps the most common is Single Error Correct, Double Error Detect (SECDED) which uses an extra byte per 64-bit word. ECC modules usually carry a multiple of 9 instead of a multiple of 8 chips.

RankingEdit

{{#invoke:Labelled list hatnote|labelledList|Main article|Main articles|Main page|Main pages}} Sometimes memory modules are designed with two or more independent sets of DRAM chips connected to the same address and data buses; each such set is called a rank. Ranks that share the same slot, only one rank may be accessed at any given time; it is specified by activating the corresponding rank's chip select (CS) signal. The other ranks on the module are deactivated for the duration of the operation by having their corresponding CS signals deactivated. DIMMs are currently being commonly manufactured with up to four ranks per module. Consumer DIMM vendors have recently begun to distinguish between single and dual ranked DIMMs.

After a memory word is fetched, the memory is typically inaccessible for an extended period of time while the sense amplifiers are charged for access of the next cell. By interleaving the memory (e.g. cells 0, 4, 8, etc. are stored together in one rank), sequential memory accesses can be performed more rapidly because sense amplifiers have 3 cycles of idle time for recharging, between accesses.

DIMMs are often referred to as "single-sided" or "double-sided" to describe whether the DRAM chips are located on one or both sides of the module's printed circuit board (PCB). However, these terms may cause confusion, as the physical layout of the chips does not necessarily relate to how they are logically organized or accessed.

JEDEC decided that the terms "dual-sided", "double-sided", or "dual-banked" were not correct when applied to registered DIMMs (RDIMMs).

OrganizationEdit

Most DIMMs are built using "×4" ("by four") or "×8" ("by eight") memory chips with up to nine chips per side; "×4" and "×8" refer to the data width of the DRAM chips in bits. High-capacity DIMMs such as 256 GB DIMMs can have up to 19 chips per side.

In the case of "×4" registered DIMMs, the data width per side is 36 bits; therefore, the memory controller (which requires 72 bits) needs to address both sides at the same time to read or write the data it needs. In this case, the two-sided module is single-ranked. For "×8" registered DIMMs, each side is 72 bits wide, so the memory controller only addresses one side at a time (the two-sided module is dual-ranked).

The above example applies to ECC memory that stores 72 bits instead of the more common 64. There would also be one extra chip per group of eight, which is not counted.

SpeedsEdit

For various technologies, there are certain bus and device clock frequencies that are standardized; there is also a decided nomenclature for each of these speeds for each type.

DIMMs based on Single Data Rate (SDR) DRAM have the same bus frequency for data, address and control lines. DIMMs based on Double Data Rate (DDR) DRAM have data but not the strobe at double the rate of the clock; this is achieved by clocking on both the rising and falling edge of the data strobes. Power consumption and voltage gradually became lower with each generation of DDR-based DIMMs.

Another influence is Column Access Strobe (CAS) latency, or CL, which affects memory access speed. This is the delay time between the READ command and the moment data is available. See main article CAS/CL.

Template:Col-float Template:Table alignment

SDR SDRAM DIMMs
Chip Module Effective clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
SDR-66 PC-66 66 66 3.3
SDR-100 PC-100 100 100 3.3
SDR-133 PC-133 133 133 3.3

Template:Table alignment

DDR SDRAM (DDR1) DIMMs
Chip Module Memory clock
(Template:Abbr)
I/O bus clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
DDR-200 PC-1600 100 100 200 2.5
DDR-266 PC-2100 133 133 266 2.5
DDR-333 PC-2700 166 166 333 2.5
DDR-400 PC-3200 200 200 400 2.6

Template:Table alignment

DDR2 SDRAM DIMMs
Chip Module Memory clock
(Template:Abbr)
I/O bus clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
DDR2-400 PC2-3200 100 200 400 1.8
DDR2-533 PC2-4200 133 266 533 1.8
DDR2-667 PC2-5300 166 333 667 1.8
DDR2-800 PC2-6400 200 400 800 1.8
Template:Nowrap Template:Nowrap 266 533 1066 1.8

Template:Col-float-break

Template:Table alignment

DDR3 SDRAM DIMMs
Chip Module Memory clock
(Template:Abbr)
I/O bus clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
DDR3-800 PC3-6400 100 400 800 1.5
DDR3-1066 PC3-8500 133 533 1066 1.5
DDR3-1333 PC3-10600 166 667 1333 1.5
DDR3-1600 PC3-12800 200 800 1600 1.5
DDR3-1866 PC3-14900 233 933 1866 1.5
DDR3-2133 PC3-17000 266 1066 2133 1.5
DDR3-2400 PC3-19200 300 1200 2400 1.5

Template:Table alignment

DDR4 SDRAM DIMMs
Chip Module Memory clock
(Template:Abbr)
I/O bus clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
DDR4-1600 PC4-12800 200 800 1600 1.2
DDR4-1866 PC4-14900 233 933 1866 1.2
DDR4-2133 PC4-17000 266 1066 2133 1.2
DDR4-2400 PC4-19200 300 1200 2400 1.2
DDR4-2666 PC4-21300 333 1333 2666 1.2
DDR4-3200 PC4-25600 400 1600 3200 1.2

Template:Table alignment

DDR5 SDRAM DIMMs
Chip Module Memory clock
(Template:Abbr)
I/O bus clock
(Template:Abbr)
Transfer rate
([[Transfers per second|Template:Abbr]])
Voltage
([[Volt|Template:Abbr]])
DDR5-4000 PC5-32000 2000 2000 4000 1.1
DDR5-4400 PC5-35200 2200 2200 4400 1.1
DDR5-4800 PC5-38400 2400 2400 4800 1.1
DDR5-5200 PC5-41600 2600 2600 5200 1.1
DDR5-5600 PC5-44800 2800 2800 5600 1.1
DDR5-6000 PC5-48000 3000 3000 6000 1.1
DDR5-6200 PC5-49600 3100 3100 6200 1.1
DDR5-6400 PC5-51200 3200 3200 6400 1.1
DDR5-6800 PC5-54400 3400 3400 6800 1.1
DDR5-7200 PC5-57600 3600 3600 7200 1.1
DDR5-7600 PC5-60800 3800 3800 7600 1.1
DDR5-8000 PC5-64000 4000 4000 8000 1.1
DDR5-8400 PC5-67200 4200 4200 8400 1.1
DDR5-8800 PC5-70400 4400 4400 8800 1.1

Template:Col-float-end

Form factorsEdit

Several form factors are commonly used in DIMMs. Single Data Rate Synchronous DRAM (SDR SDRAM) DIMMs were primarily manufactured in Template:Convert and Template:Convert heights. When 1U rackmount servers started becoming popular, these form factor registered DIMMs had to plug into angled DIMM sockets to fit in the Template:Convert high box. To alleviate this issue, the next standards of DDR DIMMs were created with a "low profile" (LP) height of around Template:Convert. These fit into vertical DIMM sockets for a 1U platform.

With the advent of blade servers, angled slots have once again become common in order to accommodate LP form factor DIMMs in these space-constrained boxes. This led to the development of the Very Low Profile (VLP) form factor DIMM with a height of around Template:Convert. The DDR3 JEDEC standard for VLP DIMM height is around Template:Convert. These will fit vertically in ATCA systems.

Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around Template:Convert by standards set by JEDEC. These form factors include 240-pin DIMM, SO-DIMM, Mini-DIMM and Micro-DIMM.<ref>JEDEC MO-269J Whitepaper., accessed Aug. 20, 2014.</ref>

Full-height 288-pin DDR4 DIMMs are slightly taller than their DDR3 counterparts at Template:Convert. Similarly, VLP DDR4 DIMMs are also marginally taller than their DDR3 equivalent at nearly Template:Convert.<ref>JEDEC MO-309E Whitepaper., accessed Aug. 20, 2014.</ref>

As of Q2 2017, Asus has had a PCI-E based "DIMM.2", which has a similar socket to DDR3 DIMMs and is used to put in a module to connect up to two M.2 NVMe solid-state drives. However, it cannot use common DDR type ram and does not have much support other than Asus.<ref>ASUS DIMM.2 is a M.2 Riser Card. Template:Webarchive, accessed Jun. 4, 2020.</ref>

Regular DIMMs are generally 133.35 mm in length, while SO-DIMMs are generally 67.6 mm in length.<ref name=":0">{{#invoke:citation/CS1|citation |CitationClass=web }}</ref>

See alsoEdit

Template:Portal

Template:Div col

Template:Div col end

ReferencesEdit

Template:Reflist

External linksEdit

Template:Sister project

Template:DRAM