Editing Integrated circuit packaging (section)

{{Short description|Final stage of semiconductor device fabrication}}
{{about|the final stage in the manufacturing process of integrated circuits|an article about the physical enclosure that surrounds integrated circuits|Semiconductor package }}
{{Use American English|date = March 2019}}
[[File:DIP_package_sideview.PNG|thumb|Cross section of a [[dual in-line package]]. This type of package houses a small [[Die (integrated circuit)|semiconducting die]], with microscopic wires attaching the die to the [[lead frame]]s, allowing for electrical connections to be made to a [[Printed circuit board|PCB]].]]
[[File:DIP zagotovka.jpg|thumb|Dual in-line (DIP) integrated circuit metal lead frame tape with contacts]]

'''Integrated circuit packaging''' is the final stage of [[fabrication (semiconductor)|semiconductor device fabrication]], in which the [[die (integrated circuit)|die]] is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "[[semiconductor package|package]]", supports the electrical contacts which connect the device to a circuit board.

The packaging stage is followed by testing of the integrated circuit.