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Pin grid array
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{{Short description|Type of integrated circuit packaging with the pins mounted on the underside of the package}} {{refimprove|date=December 2011}} [[File:AMD Phenom II X6 1090T (HDT90ZFBK6DGR) CPU-pins PNrΒ°0295.jpg|thumb|350px|Closeup of the pins of a pin grid array]] [[File:XC68020 bottom p1160085.jpg|thumb|The pin grid array at the bottom of prototype [[Motorola 68020]] microprocessor]] [[File:AMD Phenom X4 9750 (Underside).JPG|thumb|The pin grid array on the bottom of an [[AMD Phenom]] X4 9750 processor that uses the AMD [[Socket AM2+|AM2+ socket]]]] A '''pin grid array''' ('''PGA''') is a type of [[integrated circuit packaging]]. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart,<ref name="Nath2017">{{cite book|author=Vijay Nath|title=Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems|url=https://books.google.com/books?id=xvF5DgAAQBAJ&pg=PA304|date=24 March 2017|publisher=Springer|isbn=978-981-10-2999-8|page=304}}</ref> and may or may not cover the entire underside of the package. PGAs are often mounted on [[printed circuit board]]s using the [[Through-hole technology|through hole]] method or inserted into a [[CPU socket|socket]]. PGAs allow for more pins per integrated circuit than older packages, such as [[dual in-line package]] (DIP).
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