Editing Quad flat package (section)

{{short description|Surface mount integrated circuit package with "gull wing" pins extending from all sides}}
{{Redirect|QFP|the digital logic technology|Quantum flux parametron}}
{{refimprove|date=December 2011}}
[[Image:Z84C0010FEC LQFP.png|thumb|A [[Zilog Z80]] in a 44-pin QFP (special case: [[LQFP]])]]

A '''quad flat package''' ('''QFP''') is a [[surface-mount technology|surface-mount]]ed [[integrated circuit]] [[integrated circuit packaging|package]] with "gull wing" leads extending from each of the four sides.<ref name="Greig07"/> Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a [[pin pitch|pitch]] ranging from 0.4 to 1.0&nbsp;mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).<ref name="Cohn05"/>

The QFP component package type became common in [[Europe]] and [[United States]] during the early nineties, even though it has been used in [[Japan]]ese [[consumer electronics]] since the seventies. It is often mixed with [[through-hole|hole mounted]], and sometimes [[DIP socket|socket]]ed, components on the same [[printed circuit board]] (PCB).

A package related to QFP is [[plastic leaded chip carrier]] (PLCC) which is similar but has pins with larger pitch, 1.27&nbsp;mm (or 1/20&nbsp;inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for [[NOR flash memory|NOR flash memories]] and other programmable components.