Editing Surface-mount technology (section)

{{Short description|Method for producing electronic circuits}}
[[File:Smt closeup.jpg|thumb|Surface-mount components on a [[USB flash drive]]'s circuit board. The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) [[ferrite bead]].]]
[[File:Big SMD capacitor 2.jpg|thumb|Surface-mount [[capacitor]]]]
[[File:SMDcompared.jpeg|thumb|A [[MOSFET]], placed upon a British postage stamp for size comparison.]]

'''Surface-mount technology''' ('''SMT'''), originally called '''planar mounting''',<ref name="SMC1999">{{cite conference |title=Status of the Technology Industry Activities and Action Plan |url=http://www.ipc.org/4.0_Knowledge/4.1_Standards/smcstatus.pdf |conference=Surface Mount Technology |editor-last=Williams |editor-first=Paul |publisher=Surface Mount Council |year=1999 |url-status=live |archive-url=https://web.archive.org/web/20151228182745/http://www.ipc.org/4.0_Knowledge/4.1_Standards/smcstatus.pdf |archive-date=2015-12-28 }}</ref> is a method in which the electrical components are mounted directly onto the surface of a [[printed circuit board]] (PCB).<ref>{{cite book |doi=10.1016/B978-081551513-5.50003-6 |chapter=Introduction |title=Adhesives Technology for Electronic Applications |date=2005 |last1=Licari |first1=James J. |last2=Swanson |first2=Dale W. |pages=1–37 |isbn=978-0-8155-1513-5 }}</ref> An electrical component mounted in this manner is referred to as a '''surface-mount device''' ('''SMD'''). In industry, this approach has largely replaced [[through-hole technology]] construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality.<ref name=":0">{{Cite web |last=Staff |first=History Computer |date=2022-05-19 |title=(SMT) Surface-Mount Technology: Meaning, Definition, and Examples |url=https://history-computer.com/smt-surface-mount-technology/ |access-date=2022-09-30 |website=History-Computer |language=en-US}}</ref> It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short [[lead (electronics)|pin]]s or leads of various styles, flat contacts, a matrix of [[solder ball]]s ([[ball grid array|BGA]]s), or terminations on the body of the component.