Editing Die preparation (section)

== Wafer mounting ==
Wafer mounting is a step that is performed during the [[die (integrated circuit)|die]] preparation of a [[Wafer (electronics)|wafer]] as part of the process of [[semiconductor fabrication]]. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate [[die (integrated circuit)|dies]]. The adhesive film upon which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called.

The picture on the right shows a  300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle. In this case, a large number of dies were already removed.