Editing Land grid array (section)

==Description==
The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be connected by using an LGA socket, or by surface-mount soldering using solder paste.<ref>{{cite web|title=Land Grid Array (LGA) Socket and Package Technology|url=http://www.intel.com/content/dam/www/public/us/en/documents/guides/lga-socket-and-package-technology-training-guide.pdf|publisher=Intel|access-date=October 1, 2015}}</ref> The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowing best shapes for counterpart spring contacts including their outgoing electric connectivity to e.g. a backplane PCB.

LGA packaging is related to [[ball grid array]] (BGA) and [[pin grid array]] (PGA) packaging. Like pin grid arrays, land grid array packages are designed to fit either in a socket or be soldered directly to a circuit board, although PGA packages cannot be soldered  using surface mount technology. In contrast with a BGA, land grid array packages in unsocketed configurations have no balls, and use flat contacts which are soldered directly to the PCB.