Editing Laser engraving (section)

== Laser engraving mechanisms ==
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Laser engraving is the process of selectively removing microscopic layers of material, thus creating visible marks on the treated surface. Depending on the materials, the laser-material interactions can be different. On harder surfaces, the mechanism of action is primarily the [[ablation]] where the focused beam of laser dislodges microscopic particles from the substrate. Engraving can achieve depth of 100[[Micrometre|μm]] and beyond, whereas laser marking is typically shallower.

The choice of lasers is important for the quality of the mark. To create a clean mark, short bursts of high quality laser pulses are preferable, since they are able to transfer large amounts of energy without causing significant heating and melting of the sample. For example, engraving using femtosecond lasers enhances precision, as these lasers emit extremely short pulses that create high-resolution marks without significant heating, avoiding material distortion or alteration.<ref>{{Cite web |title=Marking and Engraving |url=https://www.litilit.com/applications/industrial/marking-and-engraving/ |access-date=2024-04-04 |website=www.litilit.com |language=en-US}}</ref> This technology is especially valuable for materials where thermal effects must be minimized, like metals, plastics, and sensitive electronics.