Editing MOSFET (section)

== History ==
The basic principle of the [[field-effect transistor]] was first patented by [[Julius Edgar Lilienfeld]] in 1925.<ref name="p1">Lilienfeld, Julius Edgar (1926-10-08) "Method and apparatus for controlling electric currents" {{US Patent|1745175A}}</ref> In 1934, inventor [[Oskar Heil]] independently patented a similar device in Europe.<ref>[http://v3.espacenet.com/publicationDetails/biblio?CC=GB&NR=439457&KC=&FT=E Heil, Oskar, "Improvements in or relating to electrical amplifiers and other control arrangements and devices"], Patent No. GB439457, European Patent Office, filed in Great Britain 1934-03-02, published December 6, 1935 (originally filed in Germany March 2, 1934).</ref>

In the 1940s, [[Bell Labs]] scientists [[William Shockley]], [[John Bardeen]] and [[Walter Houser Brattain]] attempted to build a field-effect device, which led to their discovery of the [[transistor]] effect. However, the structure failed to show the anticipated effects, due to the problem of [[surface states]]: traps on the semiconductor surface that hold electrons immobile. With no [[surface passivation]], they were only able to build the [[Bipolar junction transistor|BJT]] and [[thyristor]] transistors. 

In 1955, [[Carl Frosch]] and Lincoln Derick accidentally grew a layer of silicon dioxide over the silicon wafer, for which they observed surface passivation effects.<ref name=":0">{{Cite journal |last1=Huff |first1=Howard |last2=Riordan |first2=Michael |date=2007-09-01 |title=Frosch and Derick: Fifty Years Later (Foreword) |url=https://iopscience.iop.org/article/10.1149/2.F02073IF |journal=The Electrochemical Society Interface |volume=16 |issue=3 |pages=29 |doi=10.1149/2.F02073IF |issn=1064-8208}}</ref><ref>{{Cite patent|number=US2802760A|title=Oxidation of semiconductive surfaces for controlled diffusion|gdate=1957-08-13|invent1=Lincoln|invent2=Frosch|inventor1-first=Derick|inventor2-first=Carl J.|url=https://patents.google.com/patent/US2802760A}}</ref> By 1957, Frosch and Derick, using masking and predeposition, were able to manufacture silicon dioxide transistors, in which drain and source were adjacent at the same surface.<ref>{{Cite journal |last1=Frosch |first1=C. J. |last2=Derick |first2=L |date=1957 |title=Surface Protection and Selective Masking during Diffusion in Silicon |url=https://iopscience.iop.org/article/10.1149/1.2428650 |journal=Journal of the Electrochemical Society |language=en |volume=104 |issue=9 |pages=547 |doi=10.1149/1.2428650}}</ref> They showed that silicon dioxide insulated, protected silicon wafers and prevented dopants from diffusing into the wafer.<ref name=":0" /><ref>{{Cite journal |last1=Frosch |first1=C. J. |last2=Derick |first2=L |date=1957 |title=Surface Protection and Selective Masking during Diffusion in Silicon |url=https://iopscience.iop.org/article/10.1149/1.2428650 |journal=Journal of the Electrochemical Society |language=en |volume=104 |issue=9 |pages=547 |doi=10.1149/1.2428650}}</ref> At Bell Labs, the importance of Frosch and Derick technique and transistors was immediately realized. Results of their work circulated around Bell Labs in the form of BTL memos before being published in 1957. At [[Shockley Semiconductor Laboratory|Shockley Semiconductor]], Shockley had circulated the preprint of their article in December 1956 to all his senior staff, including [[Jean Hoerni]],<ref name="Moskowitz">{{cite book |last1=Moskowitz |first1=Sanford L. |url=https://books.google.com/books?id=2STRDAAAQBAJ&pg=PA168 |title=Advanced Materials Innovation: Managing Global Technology in the 21st century |date=2016 |publisher=[[John Wiley & Sons]] |isbn=978-0-470-50892-3 |page=168}}</ref><ref>{{cite book |author1=Christophe Lécuyer |url=https://books.google.com/books?id=LaZpUpkG70QC&pg=PA62 |title=Makers of the Microchip: A Documentary History of Fairchild Semiconductor |author2=David C. Brook |author3=Jay Last |date=2010 |publisher=MIT Press |isbn=978-0-262-01424-3 |pages=62–63}}</ref><ref>{{cite book |last1=Claeys |first1=Cor L. |url=https://books.google.com/books?id=bu22JNYbE5MC&pg=PA27 |title=ULSI Process Integration III: Proceedings of the International Symposium |date=2003 |publisher=[[The Electrochemical Society]] |isbn=978-1-56677-376-8 |pages=27–30}}</ref><ref name="Lojek120">{{cite book |last1=Lojek |first1=Bo |title=History of Semiconductor Engineering |date=2007 |publisher=[[Springer Science & Business Media]] |isbn=9783540342588 |page=120}}</ref> who would later invent the [[planar process]] in 1959 while at [[Fairchild Semiconductor]].<ref>{{patent|US|3025589|Hoerni, J. A.: "Method of Manufacturing Semiconductor Devices” filed May 1, 1959}}</ref><ref>{{patent|US|3064167|Hoerni, J. A.: "Semiconductor device" filed May 15, 1960}}</ref> After this, J.R. Ligenza and W.G. Spitzer studied the mechanism of thermally grown oxides, fabricated a high quality Si/[[Silicon dioxide|SiO<sub>2</sub>]] stack and published their results in 1960.<ref>{{Cite journal |last1=Ligenza |first1=J. R. |last2=Spitzer |first2=W. G. |date=1960-07-01 |title=The mechanisms for silicon oxidation in steam and oxygen |url=https://linkinghub.elsevier.com/retrieve/pii/0022369760902195 |journal=Journal of Physics and Chemistry of Solids |volume=14 |pages=131–136 |doi=10.1016/0022-3697(60)90219-5 |bibcode=1960JPCS...14..131L |issn=0022-3697}}</ref><ref name="Deal">{{cite book |last1=Deal |first1=Bruce E. |title=Silicon materials science and technology |date=1998 |publisher=[[The Electrochemical Society]] |isbn=978-1566771931 |page=183 |chapter=Highlights Of Silicon Thermal Oxidation Technology |chapter-url=https://books.google.com/books?id=cr8FPGkiRS0C&pg=PA183}}</ref><ref>{{cite book |last1=Lojek |first1=Bo |title=History of Semiconductor Engineering |date=2007 |publisher=Springer Science & Business Media |isbn=978-3540342588 |page=322}}</ref>

[[file:Threshold formation nowatermark.gif|thumb|upright=1.3|Simulation of formation of inversion channel (electron density) and attainment of threshold vol&shy;tage (IV) in a nanowire MOSFET. Note: [[Threshold voltage]] for this device lies around 0.45&nbsp;V.]]

Following this research, [[Mohamed Atalla]] and [[Dawon Kahng]] proposed a silicon MOS transistor in 1959<ref name="Bassett22">{{cite book |last1=Bassett |first1=Ross Knox |title=To the Digital Age: Research Labs, Start-up Companies, and the Rise of MOS Technology |date=2007 |publisher=[[Johns Hopkins University Press]] |isbn=978-0-8018-8639-3 |pages=22–23 |url=https://books.google.com/books?id=UUbB3d2UnaAC&pg=PA22}}</ref> and successfully demonstrated a working MOS device with their Bell Labs team in 1960.<ref>{{cite journal |last1=Atalla |first1=M. |author1-link=Mohamed Atalla |last2=Kahng |first2=D. |author2-link=Dawon Kahng |date=1960 |title=Silicon-silicon dioxide field induced surface devices |journal=IRE-AIEE Solid State Device Research Conference}}</ref><ref>{{cite journal |title=1960 – Metal Oxide Semiconductor (MOS) Transistor Demonstrated |url=https://www.computerhistory.org/siliconengine/metal-oxide-semiconductor-mos-transistor-demonstrated/ |journal=The Silicon Engine |publisher=[[Computer History Museum]] |access-date=2023-01-16}}</ref> The first MOS transistor at Bell Labs was about 100 times slower than contemporary [[bipolar transistors]] and was initially seen as inferior. Nevertheless, Kahng pointed out several advantages of the device, notably ease of fabrication and its application in [[integrated circuit]]s.<ref>{{Cite book |last=Ross |first=Bassett |title=To the Digital Age: Research Labs, Start-up Companies, and the Rise of MOS Technology |publisher=JHU Press |year=2002 |pages=12–28}}</ref>