Editing Quad flat package (section)

==Limitations==
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on [[small outline package]]s) to 20 and later 12 (1.27&nbsp;mm, 0.51&nbsp;mm and 0.30&nbsp;mm respectively). However, this close lead spacing made [[solder bridge]]s more likely and put higher demands on the soldering process and alignment of parts during assembly.<ref name="Greig07"/> The later [[pin grid array]] (PGA) and [[ball grid array]] (BGA) packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing.