Editing Solid Logic Technology (section)

==Details==
SLT used silicon planar glass-encapsulated transistors and diodes.<ref name=Evans>{{cite journal |title=Solid Logic Technology: Versatile, High-Performance Microelectronics |last1=Davis|first1=E.M. |last2=Harding |first2=W.E. |last3=Schwartz |first3=R.S. |last4=Corning |first4=J.J. |journal=IBM Journal of Research and Development |volume=8|issue=2 |pages=102–114| doi=10.1147/rd.82.0102|date=April 1964|s2cid=13288023 }}</ref>

SLT uses dual diode chips and individual transistor chips each approximately {{convert|0.025|inch}} square.<ref name=ALD/>{{rp|15}} The chips are mounted on a {{convert|0.5|inch}} square substrate with silk-screened resistors and printed connections. The whole is encapsulated to form a {{convert|0.5|inch}} square module. Up to 36 modules are mounted on each card, though a few card types had just discrete components and no modules. Cards plug into boards which are connected to form gates which form frames.<ref name=ALD/>{{rp|15}}

SLT voltage levels, logic low to logic high, varied by circuit speed:<ref name=ALD/>{{rp|16}}

:High speed (5-10 ns) 0.9 to 3.0 V
:Medium speed (30 ns) 0.0 to 3.0 V
:Low speed (700 ns) 0.0 to 12.0 V

{{plain image with caption|IBM SLT wafers.agr.JPG|align=center|width=800px|caption=Steps in manufacturing Solid Logic Technology hybrid modules. The process starts with a blank ceramic wafer, {{convert|1/2|in|mm}} square. Circuits are laid down first, followed by resistive material. Pins are added, the circuits are soldered and the resistors trimmed to the desired value. Then individual transistors and diodes are added and the package is encapsulated.|triangle=triangle}}