Editing Surface-mount technology (section)

== History ==

Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity.<ref>{{cite journal |last1=Garner |first1=R. |last2=Taylor |first2=D. |title=Surface mount packaging |journal=Microelectronics Journal |date=1 May 1986 |volume=17 |issue=3 |pages=5–13 |doi=10.1016/S0026-2692(86)80170-7 }}</ref> By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.  Much of the pioneering work in this technology was done by [[IBM]]. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the [[Saturn Launch Vehicle Digital Computer|Launch Vehicle Digital Computer]] used in the [[Saturn V Instrument Unit|Instrument Unit]] that guided all [[Saturn IB]] and [[Saturn V]] vehicles.<ref name="SpaceaholicA20120010">{{cite book |url=http://spaceaholic.com/index.php/Detail/Object/Show/object_id/23 |title=Artifact: Digital Computer Memory and Circuit Boards, LVDC, Saturn IB/V Guidance, Navigation and Control |last=Schneeweis |first=Scott |work=Artifacts |publisher=Spaceaholic |url-status=live |archive-url=https://web.archive.org/web/20151228184107/http://spaceaholic.com/index.php/Detail/Object/Show/object_id/23 |archive-date=2015-12-28 |access-date=2015-12-28 }}</ref> Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB.  Components became much smaller, and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.

Often, the surface tension of the solder is enough to hold the parts to the board; in rare cases, parts on the bottom or "second" side of the board may be secured with adhesive to keep components from dropping off inside [[reflow oven]]s.<ref>{{Cite web|title=Reflow of double-sided assembly|url=http://www.surfacemountprocess.com/component-weight-limit.html|access-date=2020-09-16|website=Surface Mount Process|language=en}}</ref>  Adhesive is sometimes used to hold SMT components on the bottom side of a board if a [[wave soldering]] process is used to solder both SMT and through-hole components simultaneously.  Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a [[Selective soldering|selective solder]] mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates.

Conversely, SMT does not lend itself well to manual or low-automation fabrication, which is more economical and faster for one-off prototyping and small-scale production; this is one reason why many through-hole components are still manufactured. Some SMDs can be soldered with a temperature-controlled manual soldering iron, but those that are very small or have too fine a lead pitch are often almost impossible to manually solder without expensive equipment.