Editing Titanium diboride (section)

==Physical properties==
TiB<sub>2</sub> shares some properties with [[boron carbide]] and [[titanium carbide]], but many of its properties are superior to those of B<sub>4</sub>C & TiC:<ref name="basu">{{Cite journal|last1=Basu|first1=B.|last2=Raju|first2=G. B.|last3=Suri|first3=A. K.|date=2006-12-01|title=Processing and properties of monolithic TiB<sub>2</sub> based materials|journal=International Materials Reviews|volume=51|issue=6|pages=352–374|doi=10.1179/174328006X102529|bibcode=2006IMRv...51..352B |s2cid=137562554|issn=0950-6608}}</ref>

===Exceptional hardness at extreme temperature===
*2nd hardest material at 3000°C ([[diamond]])
*3rd hardest material at 2800°C ([[Cubic boron nitride|cBN]])
*4th hardest material at 2100°C ([[Boron carbide|B<sub>4</sub>C]])
*5th hardest material at 1000°C ([[Boron suboxide|B<sub>6</sub>O]])

===Advantages over other borides===
*Highest boride [[elastic modulus]]
*Highest boride [[fracture toughness]]
*Highest boride [[compressive strength]]
*3rd highest boride [[melting point]] (3230 °C) ([[Hafnium diboride|HfB<sub>2</sub>]])

===Other advantages===
*High [[thermal conductivity]] (60-120 W/(m K)),
*High [[electrical conductivity]] (~10<sup>5</sup> S/cm)

===Drawbacks===
* Difficult to [[Molding_(process)|mold]] due to high melting temperature
* Difficult to sinter due to the high [[covalent bonding]]
* Limited to pressing to small Monolithic pieces using of [[spark plasma sintering]]