Editing SPICE (section)

== SPICE usage beyond electronic simulation ==
As SPICE generally solves non-linear differential algebraic equations, it may be applied to simulating beyond the electrical realm.

Most prominent are '''thermal simulations''', as thermal systems may be described by lumped circuit elements mapping onto the electronic SPICE elements (heat capacity → capacitance, thermal conductance/resistance → conductance/resistance, temperature → voltage, heat flow or heat generated → current <ref>{{cite web|url=http://ngspice.sourceforge.net/ngspice-electrothermal-tutorial.html |title=ngspice tutorial on electro-thermal simulation | access-date=2022-05-06}}</ref>). As thermal and electronic systems are closely linked by power dissipation and cooling systems, electro-thermal simulation today is supported by semiconductor device manufacturers offering (transistor) models with both electrical and thermal nodes.<ref>{{cite web|url=https://www.iisb.fraunhofer.de/content/dam/iisb2014/en/Documents/Research-Areas/Energy_Electronics/publications_patents_downloads/Publications/Therm_Modelling_2000_IISB.pdf |title=Thermal Modeling of Power-electronic Systems |author1=M. Maerz |author2=Paul Nance |publisher= Fraunhofer IISB | access-date=2022-05-06}}</ref> So one may obtain electrical power dissipation, resulting in self-heating causing parameter variations, and cooling system efficiency in a single simulation run.

SPICE may very well simulate the electronics part of a motor drive. However it will equally well describe the '''electro-mechanical''' model of the motor. Again this is achieved by mapping mechanical onto the electrical elements (torque → voltage, angular velocity → current, coefficient of viscous friction → resistance, moment of inertia → inductance).<ref>{{cite web|url=https://www.precisionmicrodrives.com/ab-025 |title=AB-025: Using SPICE To Model DC Motors |date=22 September 2021 |publisher=Precision Microdrives| access-date=2022-05-06}}</ref> So again the final model consists of only SPICE compatible lumped circuit elements, but one gains mechanical together with electrical data during simulation.<ref>{{cite journal |author=Pham and Nathan |title=Circuit Modeling and SPICE Simulation of Mixed-Signal Microsystems |journal=Sensors and Materials |volume=10 |number=7 |date=1998 |pages=435–460 |url=https://www.myukk.org/SM2017/sm_pdf/SM345.pdf }}</ref>

'''Electromagnetic modeling''' is accessible to a SPICE simulator via the PEEC (partial element equivalent circuit) method.<ref name="ruehli2017">{{cite book|author1=Albert E. Ruehli|author2=Giulio Antonini|author3=Lijun Jiang|title=Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques|url=https://books.google.com/books?id=v-UGCwAAQBAJ&q=CIRCUIT+ORIENTED+ELECTROMAGNETIC+MODELING+USING+THE+PEEC+TECHNIQUES|year=2017|publisher=Wiley|isbn=978-1-11-843664-6}}</ref> Maxwell's equations have been mapped, RLC, Skin effect, dielectric or magnetic materials and incident or radiated fields have been modelled.

However, as of 2019, SPICE cannot{{elaborate|reason=Obviously with a simple enough model, you can simulate photonics.  If it cannot simulate, then simulate must have a specialize meaning.  What is it?|date=May 2025}} be used to "simulate photonics and electronics together in a '''photonic circuit simulator'''",<ref>{{cite journal |last1=Bogaerts |first1=Wim |last2=Chrostowski |first2=Lukas |title=Silicon Photonics Circuit Design: Methods, Tools and Challenges |journal=[[Laser & Photonics Reviews]] |date=April 2018 |volume=12 |issue=4 |pages=1700237 |doi=10.1002/lpor.201700237 |bibcode=2018LPRv...1200237B |doi-access=free |hdl=1854/LU-8578535 |hdl-access=free}}</ref> and thus it is not yet considered as a test simulator for photonic integrated circuits.

'''Micro-fluidic circuits''' have been modelled with SPICE<ref>{{cite book |first1=H. |last1=Takao |first2=M. |last2=Sugiura |first3=M. |last3=Ishida |first4= K. |last4=Terao |first5=T |last5=Suzuki |first6=F |last6=Shimokawa |first7=F. |last7=Oohira |chapter=Micro fluidic circuit design with |title=2011 IEEE 24th International Conference on Micro Electro Mechanical Systems |chapter-url=https://ieeexplore.ieee.org/document/5734635 |publisher=IEEE |date=2011|pages=1154–1157 |doi=10.1109/MEMSYS.2011.5734635 |isbn=978-1-4244-9632-7 |s2cid=24263237 }}</ref> by creating a pneumatic FET.

SPICE has been applied to model the interface between '''biological and electronic systems''', e.g. as a design tools for synthetic biology and for the virtual prototyping of biosensors and lab-on-chip.<ref>{{cite journal |author=Morgan Madec e.a. |title=Modeling and simulation of biological systems using SPICE language |journal=PLOS ONE|date=2017|volume=12 |issue=8 |pages=e0182385 |doi=10.1371/journal.pone.0182385 |pmid=28787027 |pmc=5546598 |bibcode=2017PLoSO..1282385M |doi-access=free }}</ref>

SPICE has been applied in '''[[operations research]]''' to evaluate perturbed [[supply chain]]s.<ref>{{cite journal |author=Francisco Campuzano-Bolarín e.a. |title=Network simulation method for the evaluation of perturbed supply chains on a finite horizon |url=https://zbmath.org/?q=an:07432780|journal=CEJOR, Cent. Eur. J. Oper. Res|date=2021|volume=29 |issue=3 |pages=823–839|doi=10.1007/s10100-021-00748-3 |s2cid=235523347 }}</ref>

SPICE has been used to model loudspeakers, earphones, and headphones.<ref>{{cite journal
  |title=SPICE simulation of headphones and earphones
  |author=Kahrs, Mark
  |journal=Audio Engineering Society Convention 127
  |year=2009
  |publisher=Audio Engineering Society
  |url=https://aes2.org/publications/elibrary-page/?id=15038 }}</ref>  Such [[electro-mechanical]] transducers often have complex input impedances (see, for example, [[Electrical characteristics of dynamic loudspeakers]]) that present difficulties to the circuits designed to drive them.  Integrated modelling of both components addresses this problem.