Editing Ball grid array (section)

== Variants ==
[[Image:Celeron mobile.jpg|thumb|300px|Intel [[Mobile Celeron]] in a [[flip-chip]] BGA2 package (FCBGA-479); the [[Die (integrated circuit)|die]] appears dark blue. Here the die has been mounted to a printed circuit board substrate below it (dark yellow, also called an interposer) using flip chip and underfill.]]
[[File:NVIDIA@220nm@Fixed-pipline@NV10@GeForce 256@T5A3202220008 S1 Taiwan A DSC01376 (29588383793).jpg|thumb|Inside a [[Wire bonding|wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU]]
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* ''CABGA'': chip array ball grid array
* ''CBGA'' and ''PBGA'' denote the ''c''eramic or ''p''lastic substrate material to which the array is attached.
* ''CTBGA'': thin chip array ball grid array
* ''CVBGA'': very thin chip array ball grid array
* ''DSBGA'': die-size ball grid array
* ''FBGA'':  fine ball grid array based on ''ball grid array'' technology. It has thinner contacts and is mainly used in [[system-on-a-chip]] designs; <br>also known as ''fine pitch ball grid array'' ([[JEDEC]]-Standard<ref>[https://www.jedec.org/standards-documents/docs/dr-427d Design Requirements - Fine Pitch Ball Grid Array Package (FBGA) DR-4.27D], jedec.org, MAR 2017</ref>) or <br>''fine line BGA'' by [[Altera]]. Not to be confused with ''fortified BGA.''<ref>Ryan J. Leng. [http://www.bit-tech.net/hardware/memory/2007/12/17/the_secrets_of_pc_memory_part_2/4 "The Secrets of PC Memory: Part 2"]. 2007.</ref>
* ''FCmBGA'': flip chip molded ball grid array
* ''LBGA'': low-profile ball grid array
* ''LFBGA'': low-profile fine-pitch ball grid array
* ''MBGA'': micro ball grid array
* ''MCM-PBGA'': multi-chip module plastic ball grid array
* ''nFBGA'': New Fine Ball Grid Array
* ''PBGA'': plastic ball grid array
* ''SuperBGA (SBGA)'': super ball grid array
* ''TABGA'': tape array BGA
* ''TBGA'': thin BGA
* ''TEPBGA'': thermally enhanced plastic ball grid array
* ''TFBGA'' or thin and fine ball grid array
* ''UFBGA'' and ''UBGA'' and ultra fine ball grid array based on pitch ball grid array.
* ''VFBGA'': very fine pitch ball grid array
* ''WFBGA'': very very thin profile fine pitch ball grid array
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Effectively also the [[flip chip]] methods for mounting chip dies to a carrier is sort of a BGA design derivate with the functional equivalent of the balls there being called bumps or micro bumps. This is realized at an already microscopic size level.

To make it easier to use ball grid array devices, most BGA packages only have balls in the outer rings of the package,
leaving the innermost square empty.

Intel used a package designated BGA1 for their [[Pentium II]] and early [[Celeron]] mobile processors.  BGA2 is Intel's package for their [[Pentium III]] and some later Celeron mobile processors. BGA2 is also known as FCBGA-479. It replaced its predecessor, BGA1.

For example, the "micro-FCBGA" (flip chip ball grid array) is Intel's current{{When|date=May 2011}} BGA mounting method for mobile processors that use a [[flip chip]] binding technology. It was introduced with the ''Coppermine'' Mobile Celeron.{{Citation needed|date=April 2016}} Micro-FCBGA has 479 balls that are 0.78&nbsp;mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.

The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable [[micro-FCPGA]] package) are arranged as the 6 outer rings of a 1.27&nbsp;mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.<ref>Intel.
"Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages".
[http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf Datasheet] {{Webarchive|url=https://web.archive.org/web/20140318091556/http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf |date=2014-03-18 }}.
2002.</ref><ref>{{Cite web |url=http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html |title=FCBGA-479 (Micro-FCBGA) |access-date=2011-12-20 |archive-date=2021-02-28 |archive-url=https://web.archive.org/web/20210228145820/http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html |url-status=dead }}</ref>