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Dual in-line package
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==Descendants== The [[Small-outline integrated circuit|SOIC]] (Small Outline IC), a surface-mount package which is currently{{when|date=August 2023}} very popular, particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being a second bend in the leads to flatten them parallel to the bottom plane of the plastic housing. The SOJ (Small Outline J-lead) and other SMT packages with "SOP" (for "Small Outline Package") in their names can be considered further relatives of the DIP, their original ancestor. SOIC packages tend to have half the pitch of DIP, and SOP are half that, a fourth of DIP. (0.1"/2.54 mm, 0.05"/1.27 mm, and 0.025"/0.635 mm, respectively) [[Pin grid array]] (PGA) packages may be considered to have evolved from the DIP. PGAs with the same {{convert|0.1|in|mm|2}} pin centers as most DIPs were popular for microprocessors from the early to mid-1980s through the 1990s. Owners of personal computers containing Intel [[80286]] through [[P5 (microarchitecture)|P5]] [[Pentium (brand)|Pentium]] processors may be most familiar with these PGA packages, which were often inserted into [[Zero Insertion Force|ZIF]] sockets on [[motherboard]]s. The similarity is such that a PGA socket may be physically compatible with some DIP devices, though the converse is rarely true.
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