Editing Plating (section)

===Tin plating===
{{See also|Tinplate}}

The [[tin]]-plating process is used extensively to protect both [[ferrous]] and [[nonferrous]] surfaces. Tin is a useful metal for the [[food processing]] industry since it is non-toxic, ductile and corrosion resistant. The excellent [[ductility]] of tin allows a tin coated base metal sheet to be formed into a variety of shapes without damage to the surface tin layer. It provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for [[steel]].

Tin is also widely used in the [[electronics]] industry because of its ability to protect the base metal from oxidation thus preserving its solderability. In electronic applications, 3% to 7% [[lead]] may be added to improve solderability and to prevent the growth of metallic "whiskers" in compression stressed deposits, which would otherwise cause electrical shorting. However, [[RoHS]] (Restriction of Hazardous Substances) regulations enacted beginning in 2006 require that no lead be added intentionally and that the maximum percentage not exceed 1%. Some exemptions have been issued to RoHS requirements in critical electronics applications due to failures which are known to have occurred as a result of tin whisker formation.