Editing Electromigration (section)

=== Bamboo structure and metal slotting ===
A wider wire results in smaller current density and, hence, less likelihood of electromigration. Also, the metal grain size has influence; the smaller grains, the more grain boundaries and the higher likelihood of electromigration effects. However, if you reduce wire width to below the average grain size of the wire material, grain boundaries become "crosswise", more or less perpendicular to the length of the wire. The resulting structure resembles the joints in a stalk of bamboo. With such a structure, the resistance to electromigration increases, despite an increase in current density. This apparent contradiction is caused by the perpendicular position of the grain boundaries; the boundary diffusion factor is excluded, and material transport is correspondingly reduced.<ref name="Lienig" /><ref name="Zamri">M. Zamri ''et al'' "In Situ TEM Observation of Fe-Included Carbon Nanofiber: Evolution of Structural and Electrical Properties in Field Emission Process", ACS Nano, 2012, 6 (11), pp 9567–9573. [Link http://pubs.acs.org/doi/abs/10.1021/nn302889e]</ref>

However, the maximum wire width possible for a bamboo structure is usually too narrow for signal lines of large-magnitude currents in analog circuits or for power supply lines. In these circumstances, slotted wires are often used, whereby rectangular holes are carved in the wires. Here, the widths of the individual metal structures in between the slots lie within the area of a bamboo structure, while the resulting total width of all the metal structures meets power requirements.<ref name="Lienig" /><ref name="Zamri"/>