Editing BTX (form factor) (section)

===picoBTX===
[[File:BTXformFactor.JPG|right|thumb|BTX form factor motherboard inside a Dell Dimension E520]]
Pico BTX is a [[motherboard]] form factor that is meant to miniaturize the {{convert|12.8|xx|10.5|in|mm|0|abbr=on}} BTX standard. Pico BTX motherboards measure {{convert|8|xx|10.5|in|mm|0|abbr=on}}. This is smaller than many current "micro"-sized motherboards, hence the name  "[[pico-|pico]]". These motherboards share a common top half with the other sizes in the BTX line, but support only one or two expansion slots, designed for half-height or riser card applications.<ref name="Toms Hardware">http://www.tomshardware.com/reviews/beginners-guide-motherboard-selection,1289-5.html {{Dead link|date=February 2022}}</ref>

Other smaller BTX sizes include: [[microBTX]] at {{convert|10.4|xx|10.5|in|mm|0|abbr=on}} and nano BTX at {{convert|8.8|xx|10.5|in|mm|0|abbr=on}}.

{|  class=wikitable
|-
! align=left | Specification
! align=left | Year
! align=left | Dimensions of motherboard
! align=left | Expansion slots
|-
| BTX
| rowspan="4" | 2004
| 10.5 × 12.8 in (266.70 × 325.12&nbsp;mm)
| 7
|-
| microBTX
| 10.5 × 10.4 in (266.70 × 264.16&nbsp;mm)
| 4
|-
| nanoBTX
| 10.5 × 8.8 in (266.70 × 223.52&nbsp;mm)
| 2
|-
| picoBTX
| 10.5 × 8.0 in (266.70 × 203.20&nbsp;mm)
| 1
|}

The heat sink to be attached to the CPU, called "Thermal Module" throughout the official specification, is no longer attached solely to the motherboard, but to the casing itself, so that the inertial load of its mass during a mechanical shock event can no longer damage the motherboard.

The structural interface between the heat sink and the chassis, is defined as 4 mounting holes with the distances of 4.4 × 2.275 in (55.79 × 111.76&nbsp;mm) between one another. And since this attachment means is also required to have a certain stiffness, it is called "Support and Retention Module (SRM)" in the specification.