Editing Integrated circuit packaging (section)

=== Electrical ===
The current-carrying traces that run out of the die, through the package, and into the [[printed circuit board]] (PCB) have very different electrical properties compared to on-chip signals.  They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance.<ref name=":02"/> Both the structure and materials must prioritize signal transmission properties, while minimizing any [[Parasitic element (electrical networks)|parasitic elements]] that could negatively affect the signal.

Controlling these characteristics is becoming increasingly important as the rest of technology begins to speed up. Packaging delays have the potential to make up almost half of a high-performance computer's delay, and this bottleneck on speed is expected to increase.<ref name=":02">{{Cite book|title=Digital Integrated Circuits|last=Rabaey|first=Jan|publisher=Prentice Hall, Inc.|year=2007|isbn=978-0130909961|url-access=registration|url=https://archive.org/details/agilesoftwaredev00robe|edition=2nd}}</ref>