Editing Pin grid array (section)

=== Flip chip ===
[[File:Ppga.jpg|thumb|right|The underside of a FC-PGA package (The die is on the other side.)]]

A [[flip-chip]] pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the [[Die (integrated circuit)|die]] faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the [[heatsink]] or other cooling mechanism.

FC-PGA CPUs were introduced by [[Intel]] in 1999, for Coppermine core [[Pentium III]] and [[Celeron]]<ref>{{cite web | title=Intel Releases New Design for sub-$1,000 PCs | publisher=Philippine Daily Inquirer | date=April 24, 2000 }}</ref> processors based on [[Socket 370]], and were produced until [[Intel Socket G3|Socket G3]] in 2013. FC-PGA processors fit into [[zero insertion force]] (ZIF) [[CPU socket|motherboard sockets]]; similar packages were also used by AMD.<!--FIXME: does AMD use the name FC-PGA or some term of their own?-->