Editing Plating (section)

==Electroless deposition==
{{Main|Electroplating#Alternatives to electroplating}}

[[Electroless Deposition|Electroless deposition]], also known as chemical or auto-[[catalytic]] plating, is a non-[[Galvanization|galvanic]] plating method that involves several simultaneous reactions in an [[aqueous solution]], which occur without the use of external electrical power. The reaction is accomplished when [[hydrogen]] is released by a reducing agent, normally [[sodium hypophosphite]] (Note: the hydrogen leaves as a hydride ion) or [[thiourea]], and oxidized, thus producing a negative charge on the surface of the part. The most common electroless deposition method is [[electroless nickel plating]], although silver, gold and copper layers can also be applied in this manner, as in the technique of [[angel gilding]].