Editing Quad flat package (section)

=={{anchor|LQFP|TQFP|BQFP|PQFP}}Variants==
<gallery widths="200px" heights="160px">
Cyrix cx9210 gfdl (cropped).jpg|144-pin low profile quad flat package (LQFP)
PIC18F8720.jpg|80-pin thin quad flat package (TQFP) – [[PIC microcontroller]]
Sega 304-pin QFP.jpg|304-pin plastic quad flat package (QFP) with exposed [[thermally conductive pad|thermal pad]] (TP)
Cyrix Cx486SLCe-V25MP DF7339E top.jpg|100-pin bumpered quad flat package (BQFP) – [[Cyrix Cx486SLC]]
CRQFP80 UV ST62E40.jpg|80-pin ceramic quad flat package (TQFP) – [[ST6 and ST7|ST6 microcontroller]]
</gallery>

The basic form is a flat rectangular (often square) body with leads on four sides but with numerous variation in the design. These differ usually only in lead number, pitch, dimensions, and materials used (usually to improve thermal characteristics). A clear variation is '''bumpered quad flat package''' ('''BQFP''') with extensions at the four corners to protect the leads against mechanical damage before the unit is soldered.

Heat sink quad flat package, ''heatsink very thin quad flat-pack no-leads'' (''[[Quad Flat No-leads package|HVQFN]]'') is a package with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed die that can be used as ground. [[pin pitch|Spacing]] between pins can vary.

A '''thin quad flat pack''' ('''TQFP''') provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8&nbsp;mm thick depending on size. TQFP packages range from 32 pins with a 0.8&nbsp;mm lead pitch, in a package 5&nbsp;mm by 5&nbsp;mm by 1&nbsp;mm thick, to 256 pins, 28&nbsp;mm square, 1.4&nbsp;mm thick and a lead pitch of 0.4&nbsp;mm.<ref name="Cohn05"/>

TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from {{nowrap|5 mm × 5 mm}} to {{nowrap|20 × 20 mm}}. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4&nbsp;mm, 0.5&nbsp;mm, 0.65&nbsp;mm, 0.8&nbsp;mm, and 1.0&nbsp;mm. ''PQFP'', or '''plastic quad flat pack''', is a type of QFP, as is the thinner TQFP package. PQFP packages can vary in thickness from 2.0&nbsp;mm to 3.8&nbsp;mm. A '''low-profile quad flat package''' ('''LQFP''') is a [[surface mount]] [[integrated circuit]] package format with component leads extending from each of the four sides. Pins are numbered counter-clockwise from the index dot. [[pin pitch|Spacing]] between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80&nbsp;mm intervals.

{| class=wikitable
|+Other quad flat package types
! Package !! description
|-
| BQFP || bumpered quad flat package
|-
| BQFPH || bumpered quad flat package with [[heat spreader]]
|-
| CQFP || ceramic quad flat package
|-
| EQFP || plastic enhanced quad flat package
|-
| FQFP || fine pitch quad flat package
|-
| LQFP || low profile quad flat package
|-
| MQFP || metric quad flat package
|-
| NQFP || near chip-scale quad flat package.<ref name="nqfp"/>
|-
| SQFP || small quad flat package
|-
| TQFP || thin quad flat package
|-
| VQFP || very small quad flat package
|-
| VTQFP || very thin quad flat package
|-
| TDFN || thin dual flat no-lead package.<ref name="TDFN"/>
|}

Some QFP packages have an [[exposed pad]]. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. The pad is typically 10 or more mm<sup>2</sup>, and with the pad soldered down onto the ground plane, heat is passed into the PCB. This exposed pad also gives a solid ground connection. These type of QFP packages often have a '''-EP''' suffix (e.g. a LQFP-EP 64), or they have an odd number of leads, (e.g. a TQFP-101).