Editing Reflow soldering (section)

==Thermal soak zone==
The second section, thermal soak, is typically a 60 to 120 second exposure for removal of solder paste volatiles and activation of the [[flux (metallurgy)|flux]]es, where the flux components begin [[oxide]] reduction on component leads and pads. Too high a temperature can lead to solder spattering or balling as well as oxidation of the paste, the attachment pads and the component terminations. Similarly, fluxes may not fully activate if the temperature is too low. At the end of the soak zone a [[thermal equilibrium]] of the entire assembly is desired just before the reflow zone. A soak profile is suggested to decrease any delta T between components of varying sizes or if the PCB assembly is very large. A soak profile is also recommended to diminish voiding in area array type packages.<ref name=indiumcorporation>[http://blogs.indium.com/blog/ed-briggs/0/0/profiling-basics-reflow-phases Profiling Basics – Reflow Phases]</ref>