Editing Slot 1 (section)

== Form factors ==
[[File:Pentium II front.jpg|thumb|Intel Pentium II CPU in SECC form factor]]
[[File:PentiumIII SECC2.jpg|thumb|Pentium III (Katmai) in SECC2: CPU at center, two chips at right are cache]]
[[File:Celeron 300A.jpg|thumb|Celeron in SEPP: CPU at center (under heat spreader), surrounding chips are resistors and bypass capacitors]]

The Single Edge Contact Cartridge, or "'''SECC'''", was used at the beginning of the Slot 1-era for Pentium II CPUs. Inside the cartridge, the CPU itself is enclosed in a hybrid plastic and metal case. The back of the housing is plastic and has several markings on it: the name, "Pentium II"; the Intel logo; a [[hologram]]; and the model number. The front consists of a black [[Anodizing|anodized]] aluminum plate, which is used to hold the CPU cooler. The SECC form is very solid, because the CPU itself is resting safely inside the case. As compared to socket-based CPUs, there are no pins that can be bent, and the CPU is less likely to be damaged by improper installation of a cooler.

Following SECC, the '''SEPP'''-form (Single Edge Processor Package) appeared on the market. It was designed for lower-priced Celeron CPUs. This form lacks a case entirely, consisting solely of the printed-circuit board holding the components.

A form factor called '''SECC2''' was used for late Pentium II and Pentium III CPUs for Slot 1, which was created to accommodate the switch to [[flip chip]] packaging.<ref>[https://web.archive.org/web/20081001190920/http://www.tomshardware.com/reviews/overclocking-special,94-2.html]</ref> Only the front plate was carried over, the coolers were now mounted straight to the PCB and exposed CPU die and are, as such, incompatible with SECC cartridges.