Editing Dynamic random-access memory (section)

==Packaging==
===Memory module===
{{Main|Memory module}}

Dynamic RAM ICs can be packaged in molded epoxy cases, with an internal lead frame for interconnections between the [[Die (integrated circuit)|silicon die]] and the package leads.  The original [[IBM PC]] design used ICs, including those for DRAM, packaged in [[dual in-line package]]s (DIP), soldered directly to the main board or mounted in sockets.  As memory density skyrocketed, the DIP package was no longer practical.  For convenience in handling, several dynamic RAM integrated circuits may be mounted on a single memory module, allowing installation of 16-bit, 32-bit or 64-bit wide memory in a single unit, without the requirement for the installer to insert multiple individual integrated circuits.  Memory modules may include additional devices for parity checking or error correction. Over the evolution of desktop computers, several standardized types of memory module have been developed.  Laptop computers, game consoles, and specialized devices may have their own formats of memory modules not interchangeable with standard desktop parts for packaging or proprietary reasons.

===Embedded===
{{Main|eDRAM}}
DRAM that is integrated into an integrated circuit designed in a logic-optimized process (such as an [[application-specific integrated circuit]], [[microprocessor]], or an entire [[system on a chip]]) is called ''embedded DRAM'' (eDRAM). Embedded DRAM requires DRAM cell designs that can be [[Semiconductor device fabrication|fabricated]] without preventing the fabrication of fast-switching transistors used in high-performance logic, and modification of the basic logic-optimized process technology to accommodate the process steps required to build DRAM cell structures.