Editing Electromigration (section)

== Further reading ==
{{refbegin}}
* {{cite journal |author-last=Black |author-first=J. R. |s2cid=109036679 |title=Electromigration - A Brief Survey and Some Recent Results |journal= IEEE Transactions on Electron Devices|volume=16 |issue=4 |pages=338–347 |date=April 1969 |doi=10.1109/T-ED.1969.16754|bibcode = 1969ITED...16..338B }}
* {{cite journal |author-last=Black |author-first=J. R. |s2cid=49732804 |title=Electromigration Failure Modes in Aluminium Metallization for Semiconductor Devices |journal= Proceedings of the IEEE|volume=57 |issue=9 |pages=1587–94 |date=September 1969 |doi=10.1109/PROC.1969.7340}}
* {{cite book |author-last=Ho |author-first=P. S. |chapter=Basic problems for Electromigration in VLSI applications |pages=288–291 |date=1982 |doi=10.1109/IRPS.1982.361947|title=20th International Reliability Physics Symposium |s2cid=26418320 }}
* {{cite journal |author-last1=Ho |author-first1=P. S. |author-last2=Kwok |author-first2=T. |title=Electromigration in metals |journal= Reports on Progress in Physics|volume=52 |issue= 3|pages=301–348 |date=1989 |doi=10.1088/0034-4885/52/3/002 |bibcode = 1989RPPh...52..301H|s2cid=250876558 }}
* {{cite journal |author-last1=Gardner |author-first1=D. S. |author-last2=Meindl |author-first2=J. D. |author-last3=Saraswat |author-first3=K. C. |title=Interconnection and Electromigration Scaling Theory |journal=  IEEE Transactions on Electron Devices|volume=34 |issue=3 |pages=633–643 |date=March 1987 |doi=10.1109/T-ED.1987.22974 |bibcode=1987ITED...34..633G|s2cid=317983 }}
* Ghate, P. B.: [https://ieeexplore.ieee.org/search/wrapper.jsp?arnumber=4208466 Electromigration-Induced Failures in VLSI Interconnects]{{dead link|date=January 2025|bot=medic}}{{cbignore|bot=medic}}, ''IEEE Conf. Publication'', Vol. 20:p 292 299, March 1982.
* {{cite journal |author-first1=G. |author-last1=Jerke |author-first2=J. |author-last2=Lienig |title=Hierarchical Current Density Verification in Arbitrarily Shaped Metallization Patterns of Analog Circuits |journal= IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems|volume=23 |issue=1 |pages=80–90 |date=January 2004 |doi=10.1109/TCAD.2003.819899|s2cid=2586433 }}
* {{cite journal |author-first1=B. D. |author-last1=Knowlton |author-first2=C. V. |author-last2=Thompson |title=Simulation of temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects |journal= Journal of Materials Research|volume=13  |issue=5 |pages= 1164–1170|date=1998|bibcode=1998JMatR..13.1164K |doi=10.1557/JMR.1998.0166 |doi-broken-date=2024-11-24 }}
* Lienig, J.: {{doi-inline|10.1145/1123008.1123017|"Introduction to Electromigration-Aware Physical Design"}}, [https://www.ifte.de/mitarbeiter/lienig/ispd06_emPaper_lienig.pdf (Download paper)] ''Proc. of the Int. Symposium on Physical Design (ISPD) 2006'', pp.&nbsp;39–46, April 2006.
* Lienig, J., Thiele, M.: {{doi-inline|10.1145/3177540.3177560|"The Pressing Need for Electromigration-Aware Physical Design"}}, [https://www.ifte.de/mitarbeiter/lienig/ispd_2018_pp144_151.pdf (Download paper)], ''Proc. of the Int. Symposium on Physical Design (ISPD) 2018'', pp.&nbsp;144–151, March 2018.
* Louie Liu, H.C., Murarka, S.: "Modeling of Temperature Increase Due to Joule Heating During Elektromigration Measurements. Center for Integrated Electronics and Electronics Manufacturing", ''Materials Research Society Symposium Proceedings'' Vol. 427:p.&nbsp;113 119.
* {{cite journal |author-first1=Tarik Omer |author-last1=Ogurtani |author-first2=Ersin Emre |author-last2=Oren |title=Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces |journal= International Journal of Solids and Structures|volume=42 |issue=13 |pages=3918–52 |date=June 2005 |doi=10.1016/j.ijsolstr.2004.11.013}}
* {{cite journal |author-first1=Fei |author-last1=Ren |author-first2=Woong |author-last2=Nah |author-first3=K. N. |author-last3=Tu |author-first4=Bingshou |author-last4=Xiong |author-first5=Luhua |author-last5=Xu |author-first6=John H. L. |author-last6=Pang |title=Electromigration induced ductile-to-brittle transition in lead-free solder joints |journal=Applied Physics Letters  |volume=89 |issue= 14|page=141914  |date=2006 |doi=10.1063/1.2358113 |bibcode=2006ApPhL..89n1914R}}
* {{cite journal |author-first1=Arijit |author-last1=Roy |author-first2=Cher Ming |author-last2=Tan |title=Very High Current Density Package Level Electromigration Test for Copper Interconnects |journal= Journal of Applied Physics|volume=103 |issue= 9|pages=093707–093707–7 |date=2008 |doi=10.1063/1.2917065 |bibcode=2008JAP...103i3707R}}
* {{cite journal |author-first1=Cher Ming |author-last1=Tan |author-first2=Arijit |author-last2=Roy |title=Electromigration in ULSI interconnects |journal=Materials Science and Engineering: R: Reports |volume=58 |issue= 1–2|pages=1–75 |date=2007 |doi=10.1016/j.mser.2007.04.002}}
* {{cite journal |author-first=K. N. |author-last=Tu |title=Recent advances on electromigration in very-large-scale-integration of interconnects |journal=Journal of Applied Physics |volume=94 |issue=9 |pages=5451–5473 |date=2003 |doi=10.1063/1.1611263 |bibcode=2003JAP....94.5451T}}
* {{cite journal |author-first1=Luhua |author-last1=Xu |author-first2=John H. L. |author-last2=Pang |author-first3=K. N. |author-last3=Tu |title=Effect of electromigration-induced back stress gradient on nano-indentation marker movement in SnAgCu solder joints |journal=Applied Physics Letters |volume=89 |issue= 22|page=221909 |date=2006 |doi=10.1063/1.2397549 |bibcode=2006ApPhL..89v1909X}}
{{refend}}

=== Books ===
* {{Cite book|author=Christou, A|title=Electromigration and Electronic Device Degradation|url=https://www.wiley.com/en-us/Electromigration+and+Electronic+Device+Degradation-p-9780471584896|publisher=Wiley|date=1993|isbn=978-0-471-58489-6}}
* {{Cite book|author=Lienig, J., Thiele, M.|title=Fundamentals of Electromigration-Aware Integrated Circuit Design|url=https://www.ifte.de/books/em/index.html|publisher=Springer|date=2018|doi=10.1007/978-3-319-73558-0|isbn=978-3-319-73557-3}}