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Computer cooling
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===Heat sink lapping=== Mass-produced CPU heat spreaders and heatsink bases are never perfectly flat or smooth; if these surfaces are placed in the best contact possible, there will be air gaps which reduce heat conduction. This can easily be mitigated by the use of thermal compound, but for the best possible results surfaces must be as flat as possible. This can be achieved by a laborious process known as [[lapping]], which can reduce CPU temperature by typically {{convert|2|C-change|0|abbr=on}}.<ref>{{Cite web|url=https://archive.techarp.com/showarticleb086.html?artno=433&pgno=0|title=Tech ARP β The CPU & Heatsink Lapping Guide|website=archive.techarp.com|access-date=7 January 2020|archive-url=https://web.archive.org/web/20180122093901/http://archive.techarp.com/showarticleb086.html?artno=433&pgno=0|archive-date=22 January 2018|url-status=live}}</ref>
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