Editing Ball grid array (section)

=== High density ===
The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins.  Pin grid arrays and dual-in-line surface mount ([[Small-outline integrated circuit|SOIC]]) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process.  As package pins got closer together, the danger of accidentally [[Solder bridging|bridging]] adjacent pins with solder grew.