Editing Quad flat package (section)

=={{anchor|CERQUAD|CQFP}}Ceramic QFP package==
Ceramic QFP packages come in two variants, CERQUAD and CQFP:

===CERQUAD packages===
Hereby the leadframe is attached between two ceramic layers of the package. The leadframe is attached using glass. This package is a variant of the CERDIP package. CERQUAD packages are the "low cost" alternative for CQFP packages, and are mainly used for terrestrial applications.
Main ceramic package manufacturers are Kyocera, NTK,... and offer the full pincount range

===CQFP packages===
Hereby the leads are soldered on top of the package. The package is a multilayer package, and is offered as HTCC (high temperature co-fired ceramic). The number of bonding decks can be one, two or three. Package is finished with a nickel plus a ''thick'' gold layer, except where the leads are soldered and decoupling capacitors are soldered on top of the package. These packages are hermetic. Two methods are used in order to make the hermetic sealing: eutectic gold-tin alloy (melting point 280{{nbsp}}°C) or seam welding. Seam welding gives rise to significantly less temperature rise in the internal of the package (e.g., the die attach). This package is the main package used for Space projects.

Due to the large body size of CQFP packages, parasitics are important for this package. Power supply decoupling is improved by having the decoupling capacitors mounted on top of this package. E.g. TI offers 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package<ref name="TI"/> E.g. Test-expert 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package.<ref name="CQFP"/>

The main ceramic package manufacturers are Kyocera (Japan), NTK (Japan), Test-Expert (Russia), etc. and offer the full pincount range. Maximum pin count is 352 pins.