Editing Thermal paste (section)

== Challenges ==
The consistency of thermal paste makes it susceptible to failure mechanisms distinct from some other thermal interface materials. A common one is pump-out, which is the loss of thermal paste from between the die and the heat sink due to their differing rates of thermal expansion and contraction. Over a large number of [[Power cycling|power cycles]], thermal paste extrudes from between the die and heat sink, which eventually causes degradation of thermal performance inasmuch as there is less paste in place.<ref name="intel-2000">{{cite journal |last1=Viswanath |first1=Ram |last2=Wakharkar |first2=Vijay |last3=Watwe |first3=Abhay |last4=Lebonheur |first4=Vassou |title=Thermal Performance Challenges from Silicon to Systems |journal=Intel Technology Journal |date=2000 |url=http://mprc.pku.edu.cn/courses/architecture/autumn2005/thermal_perf.pdf|archive-url=https://web.archive.org/web/20170808033212/http://mprc.pku.edu.cn/courses/architecture/autumn2005/thermal_perf.pdf |archive-date=8 August 2017 |access-date=8 March 2020}}</ref>

Another issue with some compounds is the separation of the polymer and filler matrix components occurs under high temperatures. The loss of polymeric material can result in poor [[Wetting|wettability]], leading to increased thermal resistance.<ref name="intel-2000"/>