Editing Computer cooling (section)

===Laptops===
Laptops present a difficult mechanical airflow design, power dissipation, and cooling challenge. Constraints specific to laptops include: the device as a whole has to be as light as possible; the form factor has to be built around the standard keyboard layout; users are very close, so noise must be kept to a minimum, and the case exterior temperature must be kept low enough to be used on a lap. Cooling generally uses forced air cooling but heat pipes and the use of the metal chassis or case as a passive heatsink are also common. Solutions to reduce heat include using lower power consumption [[ARM architecture|ARM]] or [[Intel Atom]] processors.
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File:EBHeatsink.jpg|A laptop computer's CPU and GPU heatsinks, and copper heat pipes transferring heat to an exhaust fan expelling hot air
File:HEATPIPE FIN STACK ASSEMBLY.jpg|The working fluid in the heatpipes transfers heat away from the laptop's CPU and video processor over to the fin stack. Heat is dissipated from the fin stack by method of convective heat transfer from a fan. This fin stack is from an [[HP ZBook]] mobile workstation laptop.
File:EBExhaust.JPG|The heat is expelled from a laptop by an exhaust centrifugal fan.
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