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Dual in-line package
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===Mounting=== DIPs can be mounted either by [[through-hole technology|through-hole soldering]] or in sockets. Sockets allow easy replacement of a device and eliminates the risk of damage from overheating during soldering. Generally sockets were used for high-value or large ICs, which cost much more than the socket. Where devices would be frequently inserted and removed, such as in test equipment or EPROM programmers, a [[zero insertion force]] socket would be used. DIPs are also used with breadboards, a temporary mounting arrangement for education, design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use [[point-to-point construction#'Dead bug' construction|point-to-point]] wiring with DIPs, and their appearance when physically inverted as part of this method inspires the informal term "dead bug style" for the method. <gallery widths="220px" heights="165px"> DIP sockets.jpg|0.3" wide DIP sockets with dual-wipe contacts for 16-, 14-, and 8-pin DIP ICs DIL socket 16p.jpg|0.3" wide 16-pin DIP socket with machined round contacts for DIP16 IC Textoolfassung 28 (smial).jpg|[[Zero insertion force]] (ZIF) socket for 0.6" wide DIP28W IC, commonly used on [[EPROM]] IC programmers 28 Pin IC Socket.jpg|0.3" wide DIP socket for narrow DIP28 IC, also known as DIP28N, commonly used on older Arduino boards Arduino UNO unpacked.jpg|[[Arduino]] UNO R2 board with [[ATmega328|ATmega328P]] 8-bit microcontroller in DIP28N IC socket MK38P70 and MBM2716.jpg|A DIP [[piggyback microcontroller]] from [[MOSTEK]] with attached DIP socket for an EPROM, both 0.6" wide </gallery>
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