Editing Gold plating (section)

== Electronics ==
[[File:Gold-plated electrical connectors.jpg|thumb|Gold-plated electrical connectors]]
Gold plating is often used in electronics, to provide a [[corrosion]]-resistant electrically conductive layer on [[copper]], typically in [[electrical connector]]s and [[printed circuit board]]s.

With direct gold-on-copper plating, the copper [[atom]]s tend to diffuse through the gold layer, causing [[tarnish]]ing of its surface and formation of an [[oxide]] and/or [[Sulfide|sulphide]] layer.

A layer of a suitable [[barrier metal]], usually [[nickel]], is often deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical backing for the gold layer, improving its [[wear]] resistance. It also reduces the impact of pores present in the gold layer.

Both the nickel and gold layers can be plated by [[Electrolytic process|electrolytic]] or [[Electroless plating|electroless]] processes. There are many factors to consider in selection of either electrolytic or electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing. In different applications, electrolytic or electroless plating can have cost advantages.

At higher frequencies, the [[skin effect]] may cause higher losses due to higher electrical resistance of nickel; a nickel-plated trace can have its useful length shortened three times in the 1&nbsp;GHz band in comparison with the non-plated one. Selective plating is used, depositing the nickel and gold layers only on areas where it is required and does not cause the detrimental side effects.<ref>{{cite web | url = http://www.polarinstruments.com/support/cits/AP171.html | title = Nickel-gold plating copper PCB traces | publisher = Polar Instruments | year = 2003 | access-date = 2007-03-28 | archive-date = 2022-12-07 | archive-url = https://web.archive.org/web/20221207114357/https://www.polarinstruments.com/support/cits/AP171.html | url-status = live }}</ref>

Gold plating may lead to formation of gold [[whisker (metallurgy)|whiskers]].

Wire bonding between gold plated contacts and aluminium wires or between aluminium contacts and gold wires under certain conditions develops a brittle layer of [[gold-aluminium intermetallic]]s, known as [[purple plague]].

=== Types ===
There are several types of gold plating used in the electronics industry:<ref name="PF">{{cite web |last=Weisberg |first=Alfred M. |year=1997 |title=Gold Plating |url=http://www.pfonline.com/articles/gold-plating |url-status=live |archive-url=https://web.archive.org/web/20170411221852/http://www.pfonline.com/articles/gold-plating |archive-date=2017-04-11 |access-date=2013-04-03 |publisher=Products Finishing Magazine}}[https://www.caymanfinancialreview.com/gold-melt-value/] {{Webarchive|url=https://web.archive.org/web/20221130085739/https://www.caymanfinancialreview.com/gold-melt-value/|date=2022-11-30}}</ref>
* ''Soft, pure gold plating'' is used in the [[semiconductor industry]]. The gold layer is easily soldered and [[wire bonding|wire bonded]]. Its [[Knoop hardness test|Knoop hardness]] ranges between 60 and 85. The plating baths have to be kept free of contamination.
* ''Soft, pure gold'' is deposited from special [[Electrolyte|electrolytes]]. Entire [[Printed circuit board|printed circuit boards]] can be plated. This technology can be used for depositing layers suitable for wire bonding.
* ''Bright hard gold on contacts'', with Knoop hardness between 120–300 and purity of 99.7–99.9% gold. Often contains a small amount of [[nickel]] and/or [[cobalt]]; these elements interfere with die bonding, therefore the plating baths cannot be used for semiconductors.
* ''Bright hard gold on [[printed circuit board]] tabs'' is deposited using lower concentration of gold in the baths. Usually contains nickel and/or cobalt as well. [[Edge connector]]s are often made by controlled-depth immersion of only the edge of the boards.

=== Soldering issues ===
[[File:Aupcb.jpg|thumb|150px|right|Gold-plated printed circuit board]]
[[Soldering]] gold-plated parts can be problematic as gold is soluble in [[solder]]. Solder which contains more than 4–5% gold can become brittle. The joint surface is dull-looking.

Gold reacts with both [[tin]] and [[lead]] in their liquid state, forming brittle [[intermetallics]]. When [[eutectic point|eutectic]] 63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially reacts with tin, forming the {{chem|Au||Sn|4}} compound. Particles of {{chem|Au||Sn|4}} disperse in the solder matrix, forming preferential [[cleavage (crystal)|cleavage]] planes, significantly lowering the mechanical strength and therefore reliability of the resulting solder joints.

If the gold layer does not completely dissolve into the solder, then slow intermetallic reactions can proceed in the solid state as the tin and gold atoms cross-migrate. Intermetallics have poor electrical conductivity and low strength. The ongoing intermetallic reactions also cause [[Kirkendall effect]], leading to mechanical failure of the joint, similar to the degradation of gold-aluminium bonds known as [[purple plague]].

A 2–3&nbsp;μm layer of gold dissolves completely within one second during typical [[wave soldering]] conditions. Layers of gold thinner than 0.5&nbsp;μm (0.02 [[thou (length)|thou]]) also dissolve completely into the solder, exposing the underlying metal (usually nickel) to the solder. Impurities in the nickel layer can prevent the solder from bonding to it. [[Electroless nickel plating]] contains phosphorus. Nickel with more than 8% phosphorus is not solderable.{{Citation needed|date=January 2013}} [[Electroplating|Electrodeposited]] nickel may contain [[nickel hydroxide]]. An acid bath is required to remove the [[Passivation (chemistry)|passivation]] layer before applying the gold layer; improper cleaning leads to a nickel surface difficult to solder. A stronger [[flux (metallurgy)|flux]] can help, as it aids dissolving the oxide deposits. [[Carbon]] is another nickel contaminant that hinders solderability.