Editing Surface-mount technology (section)

== Advantages ==
[[File:RC2010JK-071K2L.jpg|thumb|SMD resistors in original packaging - this packaging allows for use in a mounting machine]]
The main advantages of SMT over the through-hole technique are:<ref>{{Cite web |last=Das |first=Santosh |date=2019-10-01 |title=Surface Mount Technology Advantages and Disadvantages |url=http://www.electronicsandyou.com/blog/surface-mount-technology-advantages-and-disadvantages.html |access-date=2022-09-30 |website=Electronics Tutorial {{!}} The Best Electronics Tutorial Website |language=en-US}}</ref><ref>{{Cite web |last=Team |first=VSE {{!}} Engineering |date=2020-05-07 |title=Surface Mount Technology Advantages and Disadvantages for PCB Assembly |url=https://www.vse.com/blog/2020/05/07/surface-mount-technology-advantages-and-disadvantages-for-pcb-assembly/ |access-date=2022-09-30 |website=VSE |language=en-US}}</ref>
* Faster-automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
* Much higher component density (components per unit area) and many more connections per component.
* Components can be placed on both sides of the circuit board.
* Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.
* Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.  (On the other hand, through-hole components cannot be slightly misaligned because once the leads are through the holes, the components are fully aligned and cannot move laterally out of alignment.)
* Better mechanical performance under shock and vibration conditions (partly due to lower mass and partly due to less cantilevering)
* Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
* Better [[Electromagnetic compatibility|EMC performance]] (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.<ref name="MontroseEMC">{{cite book |last1=Montrose |first1=Mark I. |title=EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple |chapter=Components and EMC |publisher=[[John Wiley & Sons|Wiley-Interscience]] |year=1999 |page=64 |isbn=978-0780347038 }}</ref>
* Fewer holes need to be drilled.  (Drilling PCBs is time-consuming and expensive.)
* Lower initial cost and time of setting up for mass production using automated equipment.
* Many SMT parts cost less than equivalent through-hole parts.
* Smaller components.