Editing Electroplating (section)

===Barrel plating===
{{main article|Barrel plating}}
This technique of electroplating is one of the most common used in the industry for large numbers of small objects. The objects are placed in a barrel-shaped non-conductive cage and then immersed in a chemical bath containing dissolved ions of the metal that is to be plated onto them.  The barrel is then rotated, and electrical currents are run through the various pieces in the barrel, which complete circuits as they touch one another. The result is a very uniform and efficient plating process, though the finish on the end products will likely suffer from abrasion during the plating process. It is unsuitable for highly ornamental or precisely engineered items.<ref name="Tan1992">{{cite book|author=A.C. Tan|title=Tin and Solder Plating in the Semiconductor Industry|url=https://books.google.com/books?id=DyrohYlFCiYC&pg=PA122|date=30 November 1992|publisher=Springer Science & Business Media|isbn=978-0-412-48240-3|page=122|access-date=16 May 2019|archive-date=1 August 2020|archive-url=https://web.archive.org/web/20200801074731/https://books.google.com/books?id=DyrohYlFCiYC&pg=PA122|url-status=live}}</ref>