Editing Gerber format (section)

== Other PCB formats ==
Over the years there have been several attempts to replace Gerber by formats containing more information than just the layer image, e.g. netlist or component information.<ref name="history"/> None of these attempts have been widely accepted within the electronics manufacturing industry, probably because the formats are complex.<ref name="tavernier"/> Gerber remains the most widely used data transfer format.<ref name="Williams2004"/><ref name="Schroeder1998"/><ref name="Blackwell2000"/>

* [[IPC (electronics)|IPC]]-D-350 C ''Printed Board Description in Digital Format'', 1989. This specification was standardized as [[International Electrotechnical Commission|IEC]] 61182–1 in 1992 and withdrawn in 2001. Rarely used.
* [[DXF]] Sometimes used. These are typically constructed as drawings, PCB objects (tracks and pads) are lost, which makes them very difficult to use in CAM.
* [[PDF]] Sometimes used. 
* DPF Format, now at v7, a CAM format from Ucamco. Sometimes used.
* The ''Electronic Design Interchange Format'', [[EDIF]]. Rarely used.
* [[ODB++]], a CAM format from Mentor Graphics.  Sometimes used, the prevalent non-Gerber format.<ref name="mike2002">{{cite web |url=http://www.eetimes.com/electronics-news/4042914/ODB--spec-tapped-for-CAD-to-CAM-data-exchange |title=ODB++ spec tapped for CAD-to-CAM data exchange |author-first=Mike |author-last=Santarini |date=2002-01-22 |access-date=2011-09-29 |work=[[EE Times]] |archive-url=https://archive.today/20130122154623/http://www.eetimes.com/electronics-news/4042914/ODB--spec-tapped-for-CAD-to-CAM-data-exchange |archive-date=2013-01-22 |url-status=dead }}</ref>
* GenCAM: [[IPC (electronics)|IPC]]-2511A ''Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology'', 2000. Rarely used.
* GenCAM: [[IPC (electronics)|IPC]]-2511B ''Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer XML Schema Methodology'', 2002. Rarely used.
* Offspring: [[IPC (electronics)|IPC]]-2581 ''Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology'', 2004. Rarely used, but receiving more attention recently.<ref name=Goering2011>[http://www.cadence.com/Community/blogs/ii/archive/2011/10/02/ipc-2581-panel-a-spirited-discussion-on-pcb-data-transfer-formats.aspx IPC-2581 Panel: A Spirited Discussion on PCB Data Transfer Formats], Richard Goering, Cadence Design Systems blog, 2011-10-02</ref>
* STEP AP210: [[ISO 10303]]-210, ''Electronic assembly interconnect and packaging design'', first edition 2001, second edition 2008 (to be published)