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Reflow soldering
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==Etymology== The term "reflow" is used to refer to the temperature above which a solid mass of solder [[alloy]] is certain to melt (as opposed to merely soften). If cooled below this temperature, the solder will not flow. Warmed above it once more, the solder will flow again—hence "re-flow". Modern circuit assembly techniques that use reflow soldering do not necessarily allow the solder to flow more than once. They guarantee that the granulated solder contained in the solder paste surpasses the reflow temperature of the solder involved.
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