Editing Reflow soldering (section)

==Thermal profiling==
Thermal profiling is the act of measuring several points on a circuit board to determine the thermal excursion it takes through the soldering process.
In the electronics manufacturing industry, SPC (Statistical Process Control) helps determine if the process is in control, measured against the reflow parameters defined by the soldering technologies and component requirements.<ref>{{Cite web| title=IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) | url=http://www.ipc.org/TOC/IPC-7530.pdf | archive-url=https://web.archive.org/web/20040324171039/http://www.ipc.org:80/TOC/IPC-7530.pdf | archive-date=2004-03-24}}</ref><ref>{{Cite web| title=Reflow Profiling upto 16 Measurement Channels | url=http://www.solderstar.com/files/5214/3567/7718/SolderStar_Reflow_Solutions.pdf | archive-url=https://web.archive.org/web/20160616100647/http://www.solderstar.com:80/files/5214/3567/7718/SolderStar_Reflow_Solutions.pdf | archive-date=2016-06-16}}</ref>
Modern software tools allow a profile to be captured, then automatically optimized using a mathematical simulation, which greatly reduces the time needed to establish optimal settings for the process.<ref>{{Cite web|url=https://www.youtube.com/watch?v=403RFnmL2hk|title = AutoSeeker - Reflow Thermal Profile Optimisation Software|website = [[YouTube]]}}</ref>