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Desoldering
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===Surface mount=== If they do not need to be re-used, some [[Surface-mount technology|surface-mount components]] can be removed by cutting their leads and desoldering the remnants with a soldering iron. Otherwise, surface-mount components must be removed by heating the entire component to a temperature sufficient to melt the solder used, but not high or prolonged enough to damage the component. For most purposes, a temperature not exceeding {{convert|260|C|F}} for a time not exceeding 10 seconds is acceptable.<ref>{{Cite web |url=http://www.welwyn-tt.com/products/resistors/pbfree-faqs.asp |title=Typical guidelines on SMT soldering, Welwyn: "Components with Pb-free finish may be reflowed with peak temperatures of 260Β°C (10 seconds)." |access-date=2012-05-03 |archive-url=https://archive.today/20130209164647/http://www.welwyn-tt.com/products/resistors/pbfree-faqs.asp |archive-date=2013-02-09 |url-status=dead }}</ref> The entire board may be preheated to a temperature that all components can withstand indefinitely. Then localised heat is applied to the component to remove, with less heating required than from cold. Most frequently, a hot air (or hot gas) gun, with a nozzle of appropriate size and shape, is used to heat the component, with nearby components shielded from the heat if necessary, followed by removal with tweezers or a vacuum tool. Removal of multi-pin components with a soldering iron and solder removal tools is impractical, as the solder between the component and the pads remains in place, unlike solder which can be removed from a hole. Hot air (or gas) may be applied with tools ranging from some portable gas soldering irons such as the [[Cooper Tools|Weller]] Portasol Professional which can be fitted with a narrow hot-air nozzle, set to a temperature not controlled but approximately correct, to an industrial rework station with many facilities including hot-gas blowing, vacuum part holding, soldering iron head, and nozzles and fitting specific to particular component packages.
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