Editing Integrated circuit packaging (section)

== Operations ==
For traditional ICs, after [[wafer dicing]], the die is picked from the diced wafer using a vacuum tip or suction cup<ref>Die Attachment, Fluid Dispensing catalog from SPT small precision tools</ref><ref>{{cite web | url=https://www.eetimes.com/die-bonding-techniques-and-methods/ | title=Die bonding techniques and methods | date=9 July 2012 }}</ref> and undergoes ''die attachment'' which is the step during which a die is mounted and fixed to the [[Chip carrier|package]] or support structure (header).<ref name="Turner762">L. W. Turner (ed), ''Electronics Engineers Reference Book'', Newnes-Butterworth, 1976, {{ISBN|0-408-00168-2}}, pages 11-34 through 11-37</ref> In high-powered applications, the die is usually [[eutectic]] bonded onto the package, using e.g. gold-tin or gold-silicon [[solder]] (for good [[heat conduction]]). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a [[printed wiring board]]) using an [[epoxy]] [[adhesive]]. 
Alternatively dies can be attached using solder. These techniques are usually used when the die will be wire bonded; dies with [[flip chip]] technology do not use these attachment techniques.<ref>{{cite web | url=https://www.eetimes.com/die-bonding-techniques-and-methods/ | title=Die bonding techniques and methods | date=9 July 2012 }}</ref><ref>{{cite book | url=https://books.google.com/books?id=xpanL96_yBQC&q=die+attach+adhesive&pg=PA388 | title=Chip on Board: Technology for Multichip Modules | isbn=978-0-442-01441-4 | last1=Lau | first1=John H. | date=30 June 1994 | publisher=Springer }}</ref>

IC bonding is also known as die bonding, die attach, and die mount.<ref name="Oricus Semicon Solutions 2021 z292">{{cite web | title=What is the Die Attach process? | website=Oricus Semicon Solutions | date=2021-11-01 | url=https://oricus-semicon.com/what-is-the-die-attach-process/ | access-date=2024-04-22}}</ref>

The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding steps. Note that this list is not all-inclusive and not all of these operations are performed for every package, as the process is highly dependent on the [[List of electronic component packaging types|package type]].
*[[IC bonding]]
**[[Wire bonding]]
**[[Thermosonic bonding]]
**[[Down bonding]]
**[[Tape automated bonding]]
**[[Flip chip]]
**[[Quilt packaging]]
**[[Film attaching]]
**[[Spacer attaching]]
**[[Sintering die attach]]
*IC encapsulation
**[[Curing (chemistry)|Baking]]
**[[Plating]]
**[[Lasermarking]]
**[[Trim and form]]
*[[Wafer bonding]]

Sintering die attach is a process that involves placing the semiconductor die onto the substrate and then subjecting it to high temperature and pressure in a controlled environment.<ref>Buttay, Cyril, et al. [https://hal.science/file/index/docid/672619/filename/article.pdf "Die attach of power devices using silver sintering-bonding process optimization and characterization."] HiTEN 2011. 2011.</ref>