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Sodium silicate
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=== Adhesives === The adhesive properties of sodium silicate were noted as early as the 1850s<ref>{{Cite book |last=Commerce |first=Royal Society for the Encouragement of Arts, Manufactures and |url=https://books.google.com/books?id=wj1JAAAAcAAJ&pg=PA523 |title=Journal |date=1859 |publisher=RSA |language=en}}</ref> and have been widely used at least since the [[First World War]].<ref>{{Cite journal |last=Furness |first=Rex |date=1922-09-30 |title=Sodium silicate as an adhesive |url=https://onlinelibrary.wiley.com/doi/10.1002/jctb.5000411801 |journal=Journal of the Society of Chemical Industry |language=en |volume=41 |issue=18 |pages=381R–384R |doi=10.1002/jctb.5000411801}}</ref> The largest application of sodium silicate solutions is a cement for producing [[cardboard]].<ref name=Ullmann/> When used as a paper cement, the sodium silicate joint tends to crack within a few years, at which point it no longer holds the paper surfaces cemented together. Sodium silicate solutions can also be used as a spin-on adhesive layer to bond glass to glass<ref name="Wang-1997">{{Cite journal|date=1997-12-15|title=Low temperature bonding for microfabrication of chemical analysis devices|url=https://www.sciencedirect.com/science/article/abs/pii/S0925400597002943|journal=Sensors and Actuators B: Chemical|language=en|volume=45|issue=3|pages=199–207|doi=10.1016/S0925-4005(97)00294-3|issn=0925-4005|last1=Wang|first1=H.Y|last2=Foote|first2=R.S|last3=Jacobson|first3=S.C|last4=Schneibel|first4=J.H|last5=Ramsey|first5=J.M|bibcode=1997SeAcB..45..199W }}</ref> or a silicon dioxide–covered silicon wafer to one another.<ref name="Puers-1997">{{Cite journal|last1=Puers|first1=R|last2=Cozma|first2=A|date=1997-09-01|title=Bonding wafers with sodium silicate solution|url=https://iopscience.iop.org/article/10.1088/0960-1317/7/3/008|journal=Journal of Micromechanics and Microengineering|volume=7|issue=3|pages=114–117|doi=10.1088/0960-1317/7/3/008|bibcode=1997JMiMi...7..114P|s2cid=250822654|issn=0960-1317}}</ref> Sodium silicate glass-to-glass bonding has the advantage that it is a low-temperature bonding technique, as opposed to fusion bonding.<ref name="Wang-1997" /> It also requires less processing than glass-to-glass anodic bonding,<ref name="Berthold-2000">{{Cite journal|date=2000-05-15|title=Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers|url=https://www.sciencedirect.com/science/article/abs/pii/S0924424799003763|journal=Sensors and Actuators A: Physical|language=en|volume=82|issue=1–3|pages=224–228|doi=10.1016/S0924-4247(99)00376-3|issn=0924-4247|last1=Berthold|first1=A.|last2=Nicola|first2=L.|last3=Sarro|first3=P.M.|author3-link=Lina Sarro|last4=Vellekoop|first4=M.J|bibcode=2000SeAcA..82..224B }}</ref> which requires an intermediate layer such as [[silicon nitride]] (SiN) to act as a diffusion barrier for sodium ions.<ref name="Berthold-2000" /> The deposition of such a layer requires a low-pressure chemical vapor deposition step.<ref name="Berthold-2000" /> A disadvantage of sodium silicate bonding, however, is that it is very difficult to eliminate air bubbles.<ref name="Puers-1997" /> This is in part because the technique does not require a vacuum and also does not use field assistance{{clarification needed|reason=define technical term "field assistance"|date=March 2024}} as in anodic bonding.<ref name="Springer US-2008">{{Cite book|url=https://doi.org/10.1007/978-0-387-48998-8|title=Encyclopedia of Microfluidics and Nanofluidics|date=2008|publisher=Springer US|isbn=978-0-387-32468-5|editor-last=Li|editor-first=Dongqing|location=Boston, MA|language=en-gb|doi=10.1007/978-0-387-48998-8}}</ref> This lack of field assistance can sometimes be beneficial, because field assistance can provide such high attraction between wafers as to bend a thinner wafer and collapse<ref name="Springer US-2008" /> onto nanofluidic cavity or MEMS elements.
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