Editing Surface-mount technology (section)

===Infrared===
With infrared soldering, the energy for heating up the solder joint is transmitted by long-, medium- or short-wave infrared electromagnetic radiation.

Advantages:

* Easy setup
* No compressed air required for the heating process (some systems use compressed air for cooling)
* No requirement for different nozzles for many component shapes and sizes, reducing cost and the need to change nozzles
* Very uniform heating possible, assuming high-quality IR heating systems
* Gentle reflow process with low surface temperatures, assuming correct profile settings
* Fast reaction of infrared source (depends on the system used)
* Closed loop temperature control directly on the component is possible by applying a thermocouple or pyrometric measurement. This allows compensation for varying environmental influences and temperature losses. Enables use of the same temperature profile on slightly different assemblies, as the heating process adapts itself automatically. Enables (re)entry into the profile even on hot assemblies
* Direct setting of target profile temperatures and gradients possible through direct control of component temperature in each individual soldering process.
* No increased oxidation due to strong blowing of the solder joints with hot air, reduces flux wear or flux blowing away
* Documentation of the temperature elapsed on the component for each individual rework process possible

Disadvantages:

* Temperature-sensitive nearby components must be shielded from heat to prevent damage, which requires additional time for every board
* On short wavelength IR only: Surface temperature depends on the component's [[albedo]]: dark surfaces will be heated more than lighter surfaces
* Convective loss of energy at the component possible
* No reflow atmosphere possible (but also not required)