Editing Ball grid array (section)

===Difficulty of inspection===
Once the package is soldered into place, it is difficult to find soldering faults. [[X-ray]] machines, [[industrial CT scanning]] machines,<ref>"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. {{cite web|url=http://www.jgarantmc.com/ct-services.html |title=Industrial Computed Tomography Scanning Services – JG&A |access-date=2010-11-24 |url-status = dead|archive-url=https://web.archive.org/web/20100923150138/http://www.jgarantmc.com/ct-services.html |archive-date=2010-09-23 }}</ref> special microscopes, and endoscopes to look underneath the soldered package have been developed to overcome this problem.  If a BGA is found to be badly soldered, it can be removed in a ''[[rework station]]'', which is a jig fitted with infrared lamp (or hot air), a [[thermocouple]] and a vacuum device for lifting the package.  The BGA can be replaced with a new one, or it can be refurbished (or ''reballed'') and re-installed on the circuit board.  Pre-configured solder balls matching the array pattern can be used to reball BGAs when only one or a few need to be reworked.  For higher volume and repeated lab work, a stencil-configured vacuum-head pick-up and placement of loose spheres can be used.

Due to the cost of visual X-ray BGA inspection, electrical testing is very often used instead. Very common is [[boundary scan]] testing using an IEEE 1149.1 [[JTAG]] port.

A cheaper and easier inspection method, albeit destructive, is becoming increasingly popular because it does not require special equipment. Commonly referred to as [[Dye-and-Pry|dye and pry]], the process includes immersing the entire PCB or just the BGA attached module into a [[dye]], and after drying, the module is pried off and the broken joins are inspected. If a solder location contains the dye, then it indicates that the connection was imperfect.<ref>{{cite web
 | url = http://www.cascade-eng.com/docs/CS_FA_01.pdf
 | title = Dye and Pry of BGA Solder Joints
 | date = 2013-11-22
 | access-date = 2014-03-22
 | publisher = cascade-eng.com
 | archive-url = https://web.archive.org/web/20111016215109/http://www.cascade-eng.com/CESResourceLib/CS_FA_01.pdf
 | archive-date = 2011-10-16
 |url-status = dead
 }}</ref>