Editing Ball grid array (section)

=== Difficulties during circuit development ===
During development it is not practical to solder BGAs into place, and sockets are used instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.

The less reliable type is a [[ZIF socket]], with spring pinchers that grab the balls. This does not work well, especially if the balls are small.{{Citation needed|date=March 2013}}