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Zig-zag in-line package
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{{short description|Type of integrated circuit packaging}} [[Image:Ic-package-ZIP.svg|thumb|Zig-zag in-line package]] The '''zig-zag in-line package''' ('''ZIP''') is a packaging technology for [[integrated circuit]]s. It was intended as a replacement for [[Dual in-line package|dual in-line packaging]] (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a [[printed circuit board]], with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by [[surface mount technology|surface-mount]] packages such as the thin small-outline packages ([[Thin small-outline package|TSOP]]s), but are still in use. The [[quad in-line package]] uses a similar staggered [[semiconductor package]] design, but on two sides instead of one. High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a [[heatsink]]). These zig-zag packages include variations on the [[TO220]] such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in [[multi-leaded power package]]s like TDA2002/2003/2020/2030 and L200.<ref name="L2003 datasheet">http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000053.pdf {{Dead link|date=February 2022}}</ref> <gallery> Image:Zip_chip_socket.jpg|ZIP chips in ZIP sockets Image:zip_chip.jpg|ZIP chips </gallery> As for computers, [[DRAM|dynamic RAM]] ZIP chips are now only to be found in obsolete computers, some of these are: * [[Amiga 500]] expansion packs * [[Amiga 3000]] on-board memory and some expansion boards * [[Commodore CDTV]] on-board memory * [[Acorn Archimedes]] 300 and 400 series on-board memory * Acorn Archimedes A3010 and A3020 ==See also== * [[Chip carrier#Types of chip carriers|Types of chip carriers]] β list of chip package types == References == {{Reflist}}<!--added above categories/infobox footers by script-assisted edit--> {{Semiconductor packages}} {{DEFAULTSORT:Zig-Zag In-Line Package}} [[Category:Chip carriers]] {{compu-hardware-stub}}
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